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Physical Properties and Diffusion Characteristics of CVD-Grown TiSiN Films

  • Dalaver Anjum (a1), Katharine Dovidenko (a1), Serge Oktyabrsky (a1), Eric Eisenbraun (a1) and Alain E. Kaloyeros (a1)...

Abstract

TiSiN films grown by chemical vapor deposition were characterized to evaluate the properties relevant to the application as a diffusion barrier in Cu-based interconnects. The films were grown using TiI4 + SiI4 + NH3 + H2 chemistry at substrate temperature, 370°C, and SiI4 - to-TiI4 precursor flow rate ratio of 30. The combined results from x-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) revealed that the bulk of Ti32Si21N42 films were predominantly consisted of a mixture of cubic TiN and amorphous SiNx phases. The specific electrical resistivity of the films was about 2000 μΩcm which is a few times higher than that of sputtered TiSiN films having similar composition and thicknesses. The 40 nm-thick barrier appeared to be thermally stable against Cu diffusion at the annealing temperatures up to 550°C. Breakdown of this diffusion barrier occurred at 600°C and was accompanied by the formation of Cu3Si protrusions at the TiSiN/Si interface.

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