Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-26T12:39:30.241Z Has data issue: false hasContentIssue false
  • English
  • Français

Photosensitive Polyimides

Published online by Cambridge University Press:  21 February 2011

Hiroo Hiramoto
Hiroo Hiramoto*
Affiliation:
Toray Industries, Inc., Electronic and Imaging Materials Research Laboratories, Sonoyama, Otsu, Shiga 520, Japan
Get access

Abstract

Photosensitive polyimides are used as insulation and protection layers for microelectronics. They can easily give fine-patterned films with excellent characteristics of polyimides by photolithographic procedure.

Photosensitive groups such as double bonds, azides, o-nitrobenzyl and o-naphthoquinonediazides. These photosensitive groups are incorporated to polymer chains through covalent bonds or acid-base ion bonds. Some polyimides have photosensitivity even without intentionally introduced photosensitive groups. Most of photosensitive polyimides are negative working, and a few of them are positive working.

Characteristics of photosensitive polyimides are determined by two factors, the way of introducing photosensitive groups and the structures of polyimide backbone chains. Photosensitivity, resolution, purity and easiness of imidization mainly depends on the former factor. The film properties after curing are mainly determined by the latter. The film properties, however, are affected by the former when imide cyclization is imperfect.

Photosensitive polyimides are widely used as protection and insulation layers of VLSI, multi-chip modules for computers, telecommunication, linephotosensors, thermal-heads, etc.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 87
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kerwin, R.E. and Goldrick, M.R., Polymer Eng. Sci., 11, 426 (1971).Google Scholar
2. Rubner, R., Ahne, H., Kuhn, E. and Kolodziej, G., Photogra. Sci. Eng. 23, 303 (1979).Google Scholar
3. Ahne, H. and Kuhn, E., German Patent Disclosure DE 3411660A1, 1984.Google Scholar
4. Yoda, N. and Hiramoto, H., J. Macromol. Sci. (Chem.) A21, 1641 (1984).Google Scholar
5. Pfeifer, J. and Rhode, O., Proc. 2nd Intern. conf. on polyimides, New York, pp. 130 (1985).Google Scholar
6. Lin, A.A., Vinod, R.S., Giuhana, T. Arnost, R. and Eachus, R., Macromolecules, 21, 1165 (1988).Google Scholar
7. Kubota, S., Moriwaki, T., Ando, T., and Fukami, A., J. Macromol. Sci. (Chem.) A24, 1407 (1987).Google Scholar
8. Mochizuki, H., Omote, T., Koseki, K. and Yamaoka, T., Polymer Preprints, Japan, 38(3), 788 (1989).Google Scholar
9. Omote, T., Koseki, K. and Yamaoka, T., Polymer Preprints, Japan, 38(7), 1874 (1989).Google Scholar
10. Hiramoto, H., Eguchi, M., Ohbayashi, G. and Tomikawa, M., Proc. Conf. on Radiation Curing Asia, Tokyo, pp. 668 (1988).Google Scholar
11. Kojima, M., Sekine, H., Suzuki, H., Satou, H., Makino, D., Kataoka, F., Tanaka, J. and Shouji, F., Proc. 39th Electronic Components Conf., pp. 920 (1989).Google Scholar
12. Rickerl, P.G., Stephie, J.G. and Slota, P. Jr., Proc. 37th Electronic Components Conf., pp. 220 (1987).Google Scholar
13. Naito, N., Kakuda, N. and Wada, T., IEEE Electron Device Letters, EDL–6 pp. 589 (1985).Google Scholar
14. Ohsaki, T., Yasuda, T., Yamaguchi, S. and Kon, T., Proc. Electronic Manufacturing Tecnology Symp., pp. 178 (1987).Google Scholar
15. Moriya, K., Ohsaki, T. and Katsura, K., Proc. 34th Electronic Components Conf. pp. 82 (1984).Google Scholar
16. Sasaki, S., Kon, T. and Ohsaki, T., Proc.39th Electronic Components Conf., pp. 629 (1989).Google Scholar
17. Ackermann, K.P., Hug, R. and Berner, G.. Proc. Intern. Symp. On Microelectronics, pp. 519 (1986).Google Scholar
18. Takasago, H, Takada, M., Adachi, K., Endo, A., Yamada, K., Onishi, Y. and Aorihiro, A., Proc. 34th Electronic Components Conf., pp. 324 (1984).Google Scholar
19. Takasago, H., Takada, M., Adachi, K., Endo, A., Yamada, K., Makita, T., Gofuku, E. and Onishi, Y., Proc. 36th Electronic Components Conf., pp. 481 (1986).Google Scholar
20. Adachi, K., Endo, A., Takada, M., Takasago, H. and Ohnishi, Y., Pronted Circuit World Convention pp. 40 (1987).Google Scholar
21. Ogi, N., Murase, T., Nishihara, M., and Yamamoto, H., Nikkei Microdevices, 1989 (6), 50.Google Scholar