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Phenyl Silica Glass for Formation of Porous Dielectric Film

  • Kazuhiko Endo (a1), Keisuke Shinoda (a1) and Toru Tatsumi (a1)

Abstract

Phenyl and alkyl groups were introduced into silica glass in order to prevent the formation of a Si-O network and reduce its density and to reduce the dielectric constant of the glass. In this regard, the phenyl group was more effective than the alkyl group. The measured Si-O intensity of FTIR spectrum of the glass with introduced phenyl was only 14% of thermal SiO2 film, however, the thermally stable carbon component prevented further reduction in density after 400°C annealing.

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Phenyl Silica Glass for Formation of Porous Dielectric Film

  • Kazuhiko Endo (a1), Keisuke Shinoda (a1) and Toru Tatsumi (a1)

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