Hostname: page-component-848d4c4894-4rdrl Total loading time: 0 Render date: 2024-06-25T11:18:39.718Z Has data issue: false hasContentIssue false
  • English
  • Français

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition

Published online by Cambridge University Press:  15 February 2011

P. Atanasova ,
V. Bhaskaran ,
T. Kodas  and
M. Hampden-Smith
P. Atanasova
Affiliation:
Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
V. Bhaskaran
Affiliation:
Departments of Chemical & Nuclear Engineering, University of New Mexico, Albuquerque, NM 87131
T. Kodas
Affiliation:
Departments of Chemical & Nuclear Engineering, University of New Mexico, Albuquerque, NM 87131 Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
M. Hampden-Smith
Affiliation:
Chemistry, University of New Mexico, Albuquerque, NM 87131 Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
Get access

Abstract

Co-deposition of copper-palladium alloy films was demonstrated using low-pressure CVD from individual precursors - (hexafluoroacetylacetonato)copper(I)(vinyltrimethylsilane) [(hfac)Cu(I)vtms] and palladium(II)bis(hexafluoroacetylacetonate) [Pd(hfac)2], for Cu and Pd respectively. High-purity alloy films with controlled composition, microstructure and morphology were prepared and their oxidation behavior was examined at different temperatures and compared with that of pure copper CVD films with similar morphology. As-deposited copper-palladium alloy films showed improved resistance to oxidation up to 300°C in air. Enhanced oxidation resistance compared to Cu CVD films was observed at concentrations of palladium as low as 0.5 at. %.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 427: Symposium K – Advanced Metallization for Future ULSI , 1996 , 201
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Shih, D.-Y., Kim, J., Walker, G. F., Chang, C-A., Paraszczak, J., Yang, C., Appl. Phys. Lett., 59 (12), 1424 (1991)Google Scholar
2. Li, J., Mayer, J. W., Colgan, E. G., J. Appl. Phys., 70 (5), 2820 (1991)Google Scholar
3. Itow, H., Nakasaki, Y., Minamihaba, G., Suguro, K., Okano, H., Appl. Phys. Lett., 63 (7), 93(1993)Google Scholar
4. Cvitkovic, R., Ivey, D. G., Stiles, J., J. Mater. Sci., 30, 5415 (1995)Google Scholar
5. Lanford, W. A., Ding, P. J., Wang, W., Hymes, S., Murarka, S. P., Mater. Chem. Physics., 42, 192 (1995)Google Scholar
6. Lanford, W. A., Ding, P. J., Wang, W., Hymes, S., Murarka, S. P., Thin Solid Films, 262, 234 (1995)Google Scholar
7. Ding, P. J., Lanford, W. A., Hymes, S., Murarka, S. P., J. Appl. Phys., 74, 1331 (1993)Google Scholar
8. Hymes, S., Murarka, S. P., Shepard, C. and Landford, W. A., J. Appl. Phys., 71(9), 4623 (1992)Google Scholar
9. Ding, P. J., Lanford, W. A., Hymes, S., Murarka, S. P., J. Appl. Phys., 75 (7), 3627 (1994)Google Scholar
10. Cabral, C. Jr, Harper, J. M. E., Holloway, K., Smith, D. A., Schad, R. G., J. Vac. Sci. Technol. A, 10 (4), 1706 (1992)Google Scholar
11. Hu, C.-K., Luther, B., Kaufman, F. B., Hummel, J., Uzon, C., Pearson, D. J., Thin Solid Films,262, 84 (1995)Google Scholar
12. CRC Handbook of Electrical Resistivities of Binaty Metallic Alloys, edited by Schroder, K., Chemical Rubber, Boca Raton, FL, 1983, pp. 25 Google Scholar
13. Strawbridge, A., Rapp, R. A., J. Electrochem. Soc., 141 (7), 1905 (1994)Google Scholar
14. Park, C. W., Vook, R. W., Thin Solid Films, 226, 238 (1993)Google Scholar
15. Smart, Chr.J., Reynolds, Sc.K., Stains, C. L., Patil, Arv., Kirleis, J.Th., Mat. Res. Syrmp. Proc.,282, 229 (1993)Google Scholar
16. Doppelt, P., Baum, Th. H., Thin Solid Films, 270 (1995) 480 Google Scholar
17. Bhaskaran, V., Atanasova, P., Ludviksson, A., Hampden-Smith, M., Kodas, T., presented at the Advanced Metallization Conference, Portland, Oregon, 1995 (in print)Google Scholar
18. Sundararaman, M., Sharma, S. K., Kumar, L., Krishnan, R., Nuclear Instruments and Methods,191, 289 (1981)Google Scholar
19. Cullity, B. D., Elements of X-Ray Diff)action, Addison-Wesley Publishing Company, Reading, Massachusetts, 1978, pp. 377 Google Scholar