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Organofluorosilicate Glass (OFSG): A Dense Low K Dielectric with Superior Materials Properties

  • M.L. O'Neill (a1), Y.L. Cheng (a2) (a3), A.S. Lukas (a1), Y.L. Wang (a2) (a4), E.J. Karwacki (a1), M.S. Feng (a3), R.N. Vrtis (a1), J.L. Vincent (a1), B.K. Peterson (a1) and M.D. Bitner (a1)...

Abstract

Organofluorosilicate glass (OFSG) films with the composition Si:O:C:H:F were deposited via plasma-enhanced CVD from mixtures of trimethylsilane (3MS), silicon tetrafluoride (SiF4), and oxygen (O2). OFSG films have significantly enhanced mechanical strength, thermo-oxidative stability, and adhesion compared with OSG films deposited from 3MS and O2 alone. We propose that the increased density of OFSG, which helps improve mechanical strength, is balanced by the presence on non-polarizable Si-F functionalities, which serve to lower the dielectric constant.

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1. Laxman, R., Low-k Dielectrics: CVD fluorinated silicon oxides. Semiconductor Int'l, 1995. May: p. 7174.
2. MacWilliams, K, et al., Low k material optimization. IEEE Proc., 2001: p. 203205.
3. Grill, A and Patel, V., Ultralow-k dielectrics by plasma-enhanced chemical vapor deposition. Appl. Phys. Lett., 2001. 79(6): p. 803805.
4. Wu, G, Gleason, K K., Plasma-enhanced chemical vapor deposition of low k dielectric films using methylsilane, dimethylsilane, and trimethylsilane precursors. J. Vac. Sci., A 21(2)
5. Pankov, V, Alonso, J.C., Ortiz, A, Analysis of Structural changes in plasma-deposited fluorinated silicon dioxide films caused by fluorine incorporation using ring-statistics based mechanism. J. Appl. Phys., 1999. 86(1): p. 275280
6. Lubguban, J, et al., Thermal stability and breakdown strength of carbon-doped SiO2:F films prepared by plasma-enhanced chemical vapor deposition method. J. Appl. Phys., 2000. 87(8): p. 37153722.
7. Cheng, Y.L., O'Neill, M.L., et al, paper in progress.
8. Pankov, V, Alonso, J.C., Ortiz, A, Moisture stability and structural relaxation processes in plasma-deposited SiOF films. J. Vac. Sci Technol., A 17(6) Nov/Dec 1999: p. 31663171

Organofluorosilicate Glass (OFSG): A Dense Low K Dielectric with Superior Materials Properties

  • M.L. O'Neill (a1), Y.L. Cheng (a2) (a3), A.S. Lukas (a1), Y.L. Wang (a2) (a4), E.J. Karwacki (a1), M.S. Feng (a3), R.N. Vrtis (a1), J.L. Vincent (a1), B.K. Peterson (a1) and M.D. Bitner (a1)...

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