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Optimization of Psiloquest's Application Specific CMP Pads for Commercialization

Published online by Cambridge University Press:  01 February 2011

Parshuram B. Zantye ,
Yaw Obeng ,
S. Mudhivarthi  and
Ashok Kumar
Parshuram B. Zantye
Affiliation:
Psiloquest, Inc., 6901 TPC Boulevard, Suite 650 Orlando, FL 32822 Department of Mechanical Engineering
Yaw Obeng
Affiliation:
Nanomaterials and Nanomaunfacturing Research Center, University of South Florida, Tampa, FL 33620
S. Mudhivarthi
Affiliation:
Psiloquest, Inc., 6901 TPC Boulevard, Suite 650 Orlando, FL 32822 Department of Mechanical Engineering
Ashok Kumar
Affiliation:
Psiloquest, Inc., 6901 TPC Boulevard, Suite 650 Orlando, FL 32822 Department of Mechanical Engineering
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Abstract

There is a need for metrology, characterization and optimization of CMP pad architecture before being put into service. psiloQuest, Inc. has developed a novel polishing pad which is made up of polyolefin material instead of conventional polyurethane. The surface of the pad has been modified to match the surface of the material under going CMP. In this research, we have optimized the PECVD tetraethylorthosilicate (TEOS) surface coating duration and pad thickness for optimum pad output. The pad was then extensively characterized using the several standard metrology techniques such as SEM, XPS and nanoindentation. The CMP performance evaluation of all the candidate pads was done using CETR CP-4TM bench top CMP tester. There was a correlation and interdependence of the pad coating time and surface chemical, micromechanical and tribological properties. However, their impact on the pad CMP performance was found to be indirect, if any. These findings were used to optimize the pad design and architecture before commercialization. The demonstrated methodology can also be implemented for parametric optimization of polishing pads with novel designs in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W3.3
Copyright
Copyright © Materials Research Society 2005

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