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Numerical Analysis for Lateral Grain Growth of Poly-Si Thin Films Controlled by Laser-Induced Periodic Thermal Distribution

Published online by Cambridge University Press:  01 February 2011

Hirokazu Kaki
Affiliation:
JAIST(Japan Advanced Institute of Science and Technology), Tatsunokuchi, Ishikawa 923-1292, Japan
Yasunori Nakata
Affiliation:
JAIST(Japan Advanced Institute of Science and Technology), Tatsunokuchi, Ishikawa 923-1292, Japan
Susumu Horita
Affiliation:
JAIST(Japan Advanced Institute of Science and Technology), Tatsunokuchi, Ishikawa 923-1292, Japan
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Abstract

In order to obtain a large Si grain and to control the location of grain boundary in a Si film thermally melting-crystallized by pulse laser, we have proposed to use a periodic thermal distribution spontaneously induced by a linearly polarized laser beam. The lateral grain growth of polycrystalline Si thin films, which is controlled by the laser-induced periodic thermal distribution, was analyzed numerically by two-dimensional finite element computer simulations. From this analysis, it can be conclude that the laser irradiation should be performed to melt not all but most of Si film or melt it partially, making the large difference between the maximal and minimal temperature in the thermal distribution. It was also found that the temperature difference was increased with the optical absorption in the Si film and the fluence.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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