Hostname: page-component-848d4c4894-5nwft Total loading time: 0 Render date: 2024-05-08T15:40:00.623Z Has data issue: false hasContentIssue false
  • English
  • Français

Novel Technique for Measuring Through-Plane Thermo-Mechanical Properties of Thin Polymer Films

Published online by Cambridge University Press:  10 February 2011

K. S. Patel ,
Sue Ann bidstrup-Allen ,
P. A. Kohl  and
T. C. HODGE
K. S. Patel
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100
Sue Ann bidstrup-Allen
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100
P. A. Kohl
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100
T. C. HODGE
Affiliation:
Michelin Americas Research Corp., Greenville, SC
Get access

Abstract

Polymer thin films (less than 20 ltm) are widely used as coatings and inter-level dielectrics in microelectronic applications. In multi-layer structures, stresses generated in the films due to interaction with adjacent layers and solvent evaporation induced shrinkage, cause the polymer chains to orient in the plane of the film resulting in anisotropic film properties. Characterization of properties in all directions is essential for accurate electrical and mechanical design and modeling.

A new technique has been developed to measure, in-situ, the through-plane (z) properties of thin polymer films. A parallel plate capacitor device and an interdigitated electrode structure were used as sensors to detect changes in dielectric constant and thickness of thin polymer films under thermal or mechanical loading. The through-plane compression modulus and coefficient of thermal expansion were calculated and results are reported for benzocyclobutene (BCB) films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 511: Symposium E – Low Dielectric Constant Materials IV , 1998 , 183
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Microelectronics Packaging Handbook, edited by Tummala, R.R. and Ryamaszewski, E.J. (Van Nostrand-Reinhold, New York, 1997).Google Scholar
2. Garrou, P. Proc. of the IEEE, 80 (12), 1942–1954 (1992).Google Scholar
3. Bauer, C.L. and Farris, R.J. in Polyimides: Materials, Chemistry and Characterization, edited by Feger, C. Khojasteh, M.M. and McGrath, J.E. (Elsevier, Amsterdam, 1989), pp.549–562. Google Scholar
4. Coburn, J.C. Pottiger, M.T. Noe, S.C. and Senturia, S.D. J. Polym. Sci.: PartB, 32, 1271–1283 (1994).Google Scholar
5. Lin, L. Ph. D. thesis, Georgia Institute of Technology, Atlanta, GA, 1994.188 Google Scholar
6. Kumar, R. Sai Schuller, I.K. Kumar, S.S. Fartash, A. and Grimsditch, M. Mater. Res. Soc. Proc., 308, pp. 503–509 (1993).Google Scholar
7. Rogers, J.A. Dhar, L. Yang, Y. and Nelson, K.A. Annual Technical Conference (ANTEC) Proceedings, vol.2, Brookfield, CT, 1995, pp. 2812–2815.Google Scholar
8. Wu, T.Y. and Questad, D.L. Mater. Res. Soc. Symp. Proc., 264, pp. 143–160 (1992).Google Scholar
9. Sheth, K.C. Chen, M.J. and Farris, R.J. Mater. Res. Soc. Symp. Proc., 356, pp. 529–534 (1995).Google Scholar
10. Eisner, G. Kempf, J. Bartha, J.W. and Wagner, H.H. Thin Solid Films, 185 (1), 189–197 (1990).Google Scholar
11. Tong, H.M. Hsuen, H.K.D. Saenger, K.L. and Su, G.W. Rev. Sci. Instrum., 62 (2), pp. 422–430 (1991).Google Scholar
12. ASTM D150-92, 1992.Google Scholar
13. Hodge, T.C. Ph. D. thesis, Georgia Institute of Technology, Atlanta, GA, 1996.Google Scholar
14. Townsend, P.H. Barnett, D.M. and Brunner, T.A. J. Appl. Phys., 62 (11), pp. 4438–4444 (1987).Google Scholar
15. Benzocyclobutene Polymer Data Sheets, Dow Chemical Co., Microelectronics Polymer Division, Midland, MI,Google Scholar