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Nitrogen Plasma Ion Implantation into Carbon Films Deposited by the Anodic Vacuum ARc

Published online by Cambridge University Press:  21 February 2011

Imad F. Husein
Affiliation:
Plasma Science and Microelectronics Research Laboratory, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA
Fan Li
Affiliation:
Plasma Science and Microelectronics Research Laboratory, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA
Yuanzhong Zhou
Affiliation:
Plasma Science and Microelectronics Research Laboratory, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA
Ryne C. Allen
Affiliation:
Plasma Science and Microelectronics Research Laboratory, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA
Chung Chan
Affiliation:
Plasma Science and Microelectronics Research Laboratory, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA
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Abstract

Amorphous carbon films (a-C) deposited by the anodic vacuum arc on Si substrates were implanted with nitrogen using the Plasma Immersion Ion Implantation (PIII) technique to form carbon nitride films (CNX). Scanning Electron Microscopy (SEM) of the a-C films show a surface morphology with maximum grain size in the order of a few nanometers and the exclusion of macroparticles. INcreasing the nitrogen content of the CNX films increased the intensity of the X-ray Photoelecton Spectroscopy (XPS) C Is peak at 286.6 eV and formed a new peak at 285.6 eV which both can be associated with the carbon-nitrogen bond formation. Nanoindentaiton measurements showed that the hardness of the a-C films increased after implanting nitrogen into them. these CNX films exhibited a hardness of 19 GP A.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

1 Liu, A.Y. and Cohen, M.L., Science 245, 841 (1989); Phys. Rev. B 32, 7988 (1985).Google Scholar
2 Liu, A.Y. and Wentzcovitch, R.M., Phys. Rev. B 50, 10362 (1994).Google Scholar
3 Marton, D., Boyd, K.J., Al-Bayati, A.H., Todorov, S.S., and Rabalais, J.W., Phys. Rev. Lett. 73, 118 (1994).Google Scholar
4 Tse-An, Yeh, Lin, C.L., Sivertsen, J.M., and Judy, J.H., IEEE Trans. Magn. 27, 5163 (1991).Google Scholar
5 Yu, K.M., Cohen, M.L., Haller, E.E., Hansen, W.L., Liu, A.Y., and Wu, I.C., Phys. Rev.B 49, 5034 (1994).Google Scholar
6 Torng, C.J., Sivertsen, J.M., Judy, J.H., and Chang, C., J. Mater. Res. 5(11), 2490 (1990).Google Scholar
7 Niu, C., Lu, Y.z., and Lieber, C.M., Science 261, 334 (1993).Google Scholar
8 Ogata, K., Chubaci, J., and Fujimoto, F., J. appl. Phys. 76(6), 3791 (1994).Google Scholar
9 Li, D., Cutiongco, E., Chung, Y., Wong, M., and Sproul, W., Surface and Coating Technology, 68/69, 611 (1994).Google Scholar
10 Han, H. and Feldman, B.J., Solid State Communications 65(9), 921 (1988).Google Scholar
11 Meassick, S., Chan, C., and Allen, R., Surface and Coatings Tech. 54, 343 (1992).Google Scholar
12 Meassick, S., Kumpf, J., Allen, R., Chan, C., and Sroda, T., Materials Letters 14, 63 (1992).Google Scholar
13 Buck, V., Orde, J.B., and Mausbach, M., Materials Science and Engineering A140, 770(1991).Google Scholar
14 Xia, Z. and Chan, C., J. appl. Phys. 73, 3651 (1993).Google Scholar
15 Wagner, C.D., Handbook of X-Ray Photoelectron Speciroscopy, (Perkin-Elmer, Physical Electronics Division, Eden Prairie, MN, 1978.Google Scholar