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Nanocharacterization of Texture and Hillock Formation in Thin Al And Al-0.2%Cu Films for Thin-Film Transistors

  • H. Takatsuji (a1), S. Tsuji (a2), H. Kitahara (a1), K. Tsujimoto (a3), K. Kuroda (a4) and H Saka (a4)...

Abstract

The relation between the nanostructure of pure Al and Al-0.2 wt.% Cu thin films on glass substrates and anti-stress migration properties were investigated. These films were deposited on liquid-crystal display (LCD) grade glass substrate (550 x 650 mm) by means of two types of dc magnetron multi-chamber sputtering apparatus.

We developed the nanoindentation techniques to accelerate the characterization time for stress migration test. By AFM and cross-sectional TEM observations, we found an unusual three-layer structure in a Al-Cu thin film with strong anti-stress migration property.

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Nanocharacterization of Texture and Hillock Formation in Thin Al And Al-0.2%Cu Films for Thin-Film Transistors

  • H. Takatsuji (a1), S. Tsuji (a2), H. Kitahara (a1), K. Tsujimoto (a3), K. Kuroda (a4) and H Saka (a4)...

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