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Multiple Wafer Bonding for MEMS Applications

Published online by Cambridge University Press:  21 March 2011

M. Reiche ,
M. Haueis ,
J. Dual ,
C. Cavalloni  and
R. Buser
M. Reiche
Affiliation:
Max-Planck-Institut für Mikrostrukturphysik, Weinberg 2, D – 06120 Halle, Germany
M. Haueis
Affiliation:
ETH Zürich, Institute of Mechanics, Tannenstraße 3, CH – 8092 Zürich, Switzerland
J. Dual
Affiliation:
ETH Zürich, Institute of Mechanics, Tannenstraße 3, CH – 8092 Zürich, Switzerland
C. Cavalloni
Affiliation:
Kistler Instrumente AG, CH – 8408 Winterthur, Switzerland
R. Buser
Affiliation:
Interstate University of Applied Science Buchs, CH – 9471 Buchs, Switzerland
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Abstract

Most of the microelectromechanical systems (MEMS) require a 3-dimensional architecture which can efficiently be realized by multiple semiconductor wafer direct bonding. The present paper demonstrates the method on a force sensor for high resolution measurements of static loads. To minimize temperature stress an all-in silicon solution was developed in contrast to micromachined resonant force sensors published already in the literature.

The presented force sensor integrates load coupling, the excitation and detection of the vibration of the microresonator in one and the same single crystal silicon package. First measurements proved a sensitivity of 26 Hz/N and a resolution better than 3 mN.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 681: Symposium I – Wafer Bonding and Thinning Techniques for Materials Integration , 2001 , I7.2
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

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