Hostname: page-component-7479d7b7d-rvbq7 Total loading time: 0 Render date: 2024-07-12T10:18:03.488Z Has data issue: false hasContentIssue false

Morphology of Damage in Al Films Tested Under Electromigration Conditions Using the Drift Velocity Method

Published online by Cambridge University Press:  21 February 2011

Oleg V Kononenko
Affiliation:
Institute of Microelectronics Technology and High Purity Materials, Russian Academy of Sciences, Chernogolovka 142432, Moscow District, Russia.
V.N. Matveev
Affiliation:
Institute of Microelectronics Technology and High Purity Materials, Russian Academy of Sciences, Chernogolovka 142432, Moscow District, Russia.
Get access

Abstract

Pure Al films deposited by the partially ionized beam technique at bias Iavels of 0, 3 and 6 kV onto TiN sublayers were patterned for measurement for direct drift velocities. Then films were annealed in a vacuum 10−4 Pa for 1 hour. Electromigration tests were performed in an air atmosphere at a temperature of 280°C. The current density during tests was 6·105 A/cm2. Examinations in the SEM showed that the morphology of the damage on cathode and anode ends of the Al stripes depends on the bias during deposition. In the case of 0 kV bias, voids nucleate on the back and side edges of the cathode end and propagate toward the anode end. Hillock and whisker formation was observed on the anode end. The height and diameter of the whiskers were about 50 and 1–2 μm, respectively. In the case of 3 and 6 kV bias the drifting edge was smooth. Only hillocks (no whiskers) grew on the anode edge. The morphological differences of these films are discussed on the basis of self-ion bombardment effects.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Fionova, L.K., Kononenko, O.V. and Matveev, V.N., Scripta Metall. et Mater. 27, 329 (1992).Google Scholar
2. Fionova, L.K., Kononenko, O.V. and Matveev, V.N., Thin Solid Films 227, 54 (1993).Google Scholar
3. Knorr, D.B., Tracy, D.P. and Rodbell, K.P., Appl.Phys.Lett. 59, 3241 (1991).Google Scholar
4. Knorr, D.B. and Rodbell, K.P. in Materials Reliability Issies in Microelectronics II, edited by Thompson, C.V. and Lloyd, J.R. (Mater.Res.Soc.Proc.265,Pittsburgh,PA,1992) pp.113118.Google Scholar
5. Kononenko, O.V., Matveev, V.N., Kasumov, A. Yu., Kislov, N.A. and Khodos, I.I., Vacuum, in press.Google Scholar
6. Mei, S.-N. and Lu, T.-M., J. Vac. Sci. Technol. A6, 9 (1988).Google Scholar
7. Yapsir, A.S., You, L., Lu, T.-M. and Madden, M., J. Mater. Res. 4, 343 (1989).Google Scholar
8. Glickman, E.E., Osipov, N.A. and Ivanov, E.D., Mikroelektronika 2, 132 (1990).Google Scholar
9. Arzt, E., Kraft, O., Sanchez, J., Bader, S. and Nix, W.D., Mater.Res.Soc.Symp.Proc. 239, 677 (1991).Google Scholar
10. Ryan, J.G., Riendeau, J.B., Shore, S.E., Slusser, G.J., Beyar, D.C., Bouldin, D.P. and Sullivan, T.D., J.Vac.Sci.Technol. A8, 1474 (1990).Google Scholar
11. Smith, U., Kristensen, N., Ericson, F. and Schweitz, J.-A., J.Vac.Sci.Technol. A9, 2527 (1991).Google Scholar
12. Yang, G.-R., Bai, P., Lu, T.-M. and Lau, W.M., J.Appl.Phys. 66, 4519 (1989).Google Scholar
13. Yang, G.-R., Nason, T.C., Bai, P., Lu, T.-M. and Lau, W.M., J.Elecron.Mater. 20, 577 (1991).Google Scholar
14. Thouless, M.D., Acta Metall. et Mater. 41, 1057 (1993).Google Scholar
15. Glickman, E.E., presented at the International Conference on The Phisics and Technology of Metallic Nanostructures, Chernogolovka, 1994 (unpublished).Google Scholar