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Molecular dynamics simulations of wafer bonding

Published online by Cambridge University Press:  21 March 2011

Kurt Scheerschmidt
Kurt Scheerschmidt*
Affiliation:
Max Planck Institute of Microstructure Physics, Weinberg 2, D-06120 Halle/Saale, Germany, schee@mpi-halle.deTel: +49-345-5582910, Fax: +49-345-5582917
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Abstract

Molecular dynamics simulations using empirical potentials have been employed to describe atomic interactions at interfaces created by the macroscopic wafer bonding process. Investigating perfect or distorted surfaces of different semiconductor materials as well as of silica enables one to study the elementary processes and the resulting defects at the interfaces, and to characterize the ability of the potentials used. Twist rotation due to misalignment and bonding over steps influence strongly the bondability of larger areas. Empirical potentials developed by the bond order tight-binding approximation include ∏-bonds and yield enhanced interface structures, energies, and transferability to new materials systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 681: Symposium I – Wafer Bonding and Thinning Techniques for Materials Integration , 2001 , I2.3
Copyright
Copyright © Materials Research Society 2001

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References

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