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Molecular Dynamics Simulations of Fracture in Amorphous Silica

Published online by Cambridge University Press:  10 February 2011

Jinghan Wang
Affiliation:
Concurrent Computing Laboratory for Materials Simulations, Department of Physics & Astronomy and Department of Computer Science, Louisiana State University Baton Rouge, LA 70803–4001
Andrey Omeltchenko
Affiliation:
Concurrent Computing Laboratory for Materials Simulations, Department of Physics & Astronomy and Department of Computer Science, Louisiana State University Baton Rouge, LA 70803–4001
Rajiv K. Kalia
Affiliation:
Concurrent Computing Laboratory for Materials Simulations, Department of Physics & Astronomy and Department of Computer Science, Louisiana State University Baton Rouge, LA 70803–4001
Priya Vashishta
Affiliation:
Concurrent Computing Laboratory for Materials Simulations, Department of Physics & Astronomy and Department of Computer Science, Louisiana State University Baton Rouge, LA 70803–4001
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Abstract

Fracture in amorphous silica is studied using million-atom molecular dynamics simulations. The dynamics of crack propagation, internal stress fields, and the morphology of fracture surfaces are examined as a function of temperature and strain rate. At 300K and 600K we observe brittle fracture: internal stress increases to a critical value (typically 2 – 3 GPa) and then turns over when the crack reaches a terminal speed on the order of half the Rayleigh wave speed. At 900K crack propagation slows down dramatically due to plastic deformation and the material becomes ductile.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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