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Micromachined Shear Stress Sensors for Characterization of Surface Forces During Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Andrew Mueller ,
Robert White ,
Vincent Manno ,
Chris Rogers ,
Sriram Anjur  and
Mansour Moinpour
Andrew Mueller
Affiliation:
Andrew.Mueller@tufts.edu, Tufts University, Mechanical Engineering, 133 Bowdoin St, Medford, MA, 02155, United States, 617-869-9126
Robert White
Affiliation:
r.white@tufts.edu, Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Vincent Manno
Affiliation:
vincent.manno@tufts.edu, Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Chris Rogers
Affiliation:
crogers@tufts.edu, Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Sriram Anjur
Affiliation:
Sriram_Anjur@cabotcmp.com, Cabot Microelectronics, Aurora, IL, 60504, United States
Mansour Moinpour
Affiliation:
mansour.moinpour@intel.com, Intel Corporation, Santa Clara, CA, 95052, United States
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Abstract

This paper describes the fabrication and calibration of micromachined shear stress sensors intended for characterization of the local pad-wafer contact forces present during chemical-mechanical polishing. Sensors consist of arrays of microfabricated poly-dimethyl-siloxane (PDMS) posts and are able to measure forces ranging from 2 to 200 μN. The posts are 100 μm high and have diameters of 40-100 μm. Calibrated post deflection sensitivities are linear and lie between 0.2 μm/μN and 1.3μm/μN. Sensor design, fabrication, and calibration are detailed. Feasibility is established for sensor integration into a CMP scale model test setup, including an optical viewing method for observing post deflection during polishing. Initial micrographs of post deflection during polishing do not yet have sufficient resolution to determine the microscale forces during polishing.

Keywords

CMPsensorpolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 991: Symposium C – Advances and Challenges in Chemical Mechanical Planarization , 2007 , 0991-C06-03
Copyright
Copyright © Materials Research Society 2007

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References

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