Hostname: page-component-77c89778f8-sh8wx Total loading time: 0 Render date: 2024-07-19T12:21:40.135Z Has data issue: false hasContentIssue false

Melting Phenomena and Impurity Redistribution During Pulsed Laser Irradiation of Amorphous Silicon Layers

Published online by Cambridge University Press:  22 February 2011

J. Narayan
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
C. W. White
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
O. W. Holland
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
Get access

Abstract

we have investigated microstructural changes and phase transformations in 30Si+, 75As+, 63Cu+, and 115In+ implanted amorphous silicon layers as a function of pulse energy density. Cross-section electron microscopy studies have revealed the formation of two distinct regions, large and fine polycrystalline regions below the threshold for “defect-free” annealing. The fine polycrystalline region is formed primarily by explosive recrystallization, and occasionally by bulk nucleation and growth. The impurity redistribution in the large and fine polycrystalline regions were determined by Rutherford backscatterinq measurements. Large redistributions of impurities in the large poly region are consistent with velocity of solidifications of 3–5 ms−1. The nature of impurity redistributions in the fine poly region as a function of distribution coefficient provides information on the details of liquid phase crystallization phenomena.

Type
Research Article
Copyright
Copyright © Materials Research Society 1984

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

*

Research sponsored by the Division of Materials Sciences, U. S. Department of Energy under contract W-7405-eng-26 with Union Carbide Corporation.

References

REFERENCES

1.White, C. W., Narayan, J. and Young, R. T., Science 204, 461 (1979).Google Scholar
2.Narayan, J., Fletcher, J., White, C. W. and Christie, W. H., J. Appl. Phys. 52, 7121 (1981).Google Scholar
3.Narayan, J. and White, C. W., Appl. Phys. Lett. (January 1, 1984).Google Scholar
4.Narayan, J., Rozgonyi, G. R., Bensahel, D., Auvert, G., Nguyen, V. T. and Rai, A. K., p. 177 in Laser-Solid Interactions and Transient Thermal Processing of Materials, ed. by Narayan, J., Brown, W. L. and Lemons, R. A., North-Holland, New York (1983).Google Scholar
5.Narayan, J., Materials Lett. (in press).Google Scholar
6.Auvert, G., Bensahel, D., Perio, A., Nguyen, V. T., and Rozgonyi, G. A., Appl. Phys. Lett. 39, 724 (1981)Google Scholar
7.Narayan, J., Holland, O. W., White, C. W. and Young, R. T., J. Appl. Phys. (February, 1984).Google Scholar
8.Gilmer, G. H. and Leamy, H. J., p. 227 in Laser and Electron Beam Processing of Materials, ed. by White, C. W. and Peercy, P. S., Academic Press, New York (1980).Google Scholar
9.Kodera, S. H., Jap. J. Appl. Phys. 2, 212 (1965).Google Scholar