Hostname: page-component-7479d7b7d-wxhwt Total loading time: 0 Render date: 2024-07-12T01:06:23.103Z Has data issue: false hasContentIssue false

Mechanical properties of SU-8

Published online by Cambridge University Press:  10 February 2011

A. Mcaleavey
Affiliation:
ME Department, Johns Hopkins University, Baltimore, MD 21218, sharpe@jhu.edu
G. Coles
Affiliation:
ME Department, Johns Hopkins University, Baltimore, MD 21218, sharpe@jhu.edu
R. L. Edwards
Affiliation:
Applied Physics Laboratory, Johns Hopkins University, Laurel, MD 20723
W. N. Sharpe Jr.
Affiliation:
Applied Physics Laboratory, Johns Hopkins University, Laurel, MD 20723
Get access

Abstract

An existing test system for recording the stress-strain curves of metal microspecimens has been used to measure the strength of the ultrathick photoresist SU-8. The microspecimens are 3 mm long with a gage section 0.2 mm wide. The SU-8-25 specimens were 0.08 mm thick with an average strength of nearly 120 MPa, and the SU-8-50 specimens were 0.125 or 0.145 mm thick with an average strength of 130 MPa. Measurements of Young's modulus proved difficult, but a preliminary value of 3 GPa was obtained.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lee, K. Y. and 6 co-authors, “Micromachining Applications of a High Resolution Ultrathick Photoresist”, J. of Vac. Sci. Technol., pp. 3012–3016 (1995).Google Scholar
2. Despont, M., and 5 co-authors, “High-Aspect-Ratio Ultrathick Negative-Tone Near-UV Photoresist for MEMS Applications”, Proc. Tenth IEEE Int'l. Workshop on MEMS, Nagoya, Japan, pp. 518522 (1997).Google Scholar
3. Lorenz, H. and 5 co-authors "SU-8: a Low-Cost Negative Resist for MEMS”, J. Micromech. Microeng., pp. 121–124 (1997).Google Scholar
4. Lorenz, H. and 5 co-authors, “High-Aspect-Ratio, Ultrathick, Negative-Tone Near-UV Photoresist and its Applications for MEMS”, Sensors and Actuators A 64, pp. 3339 (1998).Google Scholar
5. Lorenz, H., Despont, M., Vettiger, P., and Renaud, P., “Fabrication of Photoplastic High-Aspect Ratio Microparts and Micromolds using SU-8 UV Resist”, Microsyst. Tech., pp. 143–146 (1998).Google Scholar
6. Lorenz, H., Laudon, M., and Renaud, P., “Mechanical Characterization of a New High-Aspect- Ratio Near UV-Photoresist”, Microelect. Engr., pp. 371374 (1998).Google Scholar
7. Sharpe, W. N., Jr., LaVan, D. A. and Edwards, R. L., “Mechanical Properties of LIGADeposited Nickel for MEMS Transducers”, Proceedings of Transducers '97, Chicago, IL, pp. 607610 (1997).Google Scholar
8. Sharpe, W. N., Jr., Yuan, B., and Edwards, R. L., “A New Technique for Measuring the Mechanical Properties of Thin Films”, J. of Microelectromechanical Systems, pp. 193–199 (1997).Google Scholar
9. LaVan, D. A. and Sharpe, W. N., Jr., “Tensile Testing of Microsamples”, Experimental Mechanics, in press, (1998).Google Scholar