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Mechanical Deformation Modeling of Diamond/Gaas Structures

Published online by Cambridge University Press:  10 February 2011

Nickolaos Strifas  and
Aris Christou
Nickolaos Strifas
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland College Park, MD 20742 Tel.(301)405–1414 Fax. (301) 314–2029
Aris Christou
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland College Park, MD 20742 Tel.(301)405–1414 Fax. (301) 314–2029
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Abstract

In this study a finite strain elastic-plastic finite element analysis is performed on diamond/GaAs structures. A series of models based upon the principal of superposition are proposed to investigate the mechanical deformation and thermal stress behavior of the diamond/gas structure due to coefficients of thermal expansions (CTE) mismatches. The interfacial shear and peeling stresses in multilayered stacks subjected to uniform temperature variation are studied. Finite strain elastic – plastic analysis is performed on a crack which lies on the interface between the diamond and gas materials. The ductile fracture from the tip of the interface crack, the stress and strain fields and distribution of microvoid volume fraction are analyzed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 291
Copyright
Copyright © Materials Research Society 1997

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References

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