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Mechanical and Electro-Mechanical Stress Effects on Performance of Flexible IZO TFTs

Published online by Cambridge University Press:  23 August 2012

T. L. Alford ,
Anil Indluru  and
Rajitha N. P. Vemuri
T. L. Alford
Affiliation:
School for Engineering of Matter, Transport, and Energy, Arizona State University, AZ 85287, U.S.A.
Anil Indluru*
Affiliation:
School for Engineering of Matter, Transport, and Energy, Arizona State University, AZ 85287, U.S.A.
Rajitha N. P. Vemuri
Affiliation:
School for Engineering of Matter, Transport, and Energy, Arizona State University, AZ 85287, U.S.A.
*
*Email: TA@asu.edu
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Abstract

This study reports the influence of electrical and mechanical stresses on indium zinc oxide (IZO) thin film transistors (TFTs).The deformation is introduced by mounting the samples on cylindrical structures of varying radii creating tensile or compressive strains. The mechanical stresses are parallel and perpendicular to the length of the channel layer. Results reveal that, when the stresses are parallel to the channel length, mobilities increase under tensile stresses and reduce under compressive stresses; while, the effect on sub-threshold is contrary to this. However no changes are observed for mobilities and sub-threshold swings when the stresses are perpendicular to the channel length. The TFTs exhibit stability under the electromechanical stressing with no device failure observed over prolonged stress times.

Keywords

stress/strain relationshiptransparent conductordefects
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1443: Symposium R – Bandgap Engineering and Interfaces of Metal Oxides for Energy , 2012 , mrss12-1443-r06-09
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1. Hoffman, R., Emery, T., Yeh, B., Koch, T., and Jackson, W., Proc. SID Symp. Int. Tech. Papers, 288 (2009).Google Scholar
2. Gleskova, H. and Wagner, S., IEEE Electron Device Lett., 20 (9), 473 (1999).Google Scholar
3. Venugopal, S. M., Marrs, M., Kaftanoglu, K., Dey, A., Wilson, J. R., Bawolek, E., Allee, D. R., and Loy, D., Proc. Flexible Electron. Display Conf., Phoenix, AZ, Feb. 2010.Google Scholar
4. Gleskova, H., Wagner, S., and Suo, Z., 75 (19), 3011 (1999).Google Scholar
5. Zeng, K., Zhu, F., Hu, J., Shen, L., Zhang, K., and Gong, H., Thin Solid Films, 443, 60 (2003).Google Scholar
6. Weick, B. L. and Bhushan, C., IEEE Trans. Magn., 32 (4), 3119 (1996).Google Scholar
7. Wang, M. C., Tsao, S. W., Chang, T. C., Lin, Y. P., Liu, P. T., and Chen, J. R., Solid State Electron., 54 (11), 1485 (2010).Google Scholar
8. Globus, T., Slade, H. C., Shur, M., and Hack, M., Proc. Mater. Res. Soc., 334, 823 (1994).Google Scholar
9. Sherman, S.Wagner, S., and Gottscho, R. A., Appl. Phys. Lett., 69 (21), 3242 (1996).Google Scholar
10. Shur, M. and Hack, M., J. Appl. Phys., 55 (10), 3831 (1984).Google Scholar
11. Street, R. A., Kakalios, J., and Hack, M., Phys. Rev. B, Condens. Matter, 38 (8), 5603 (1988).Google Scholar