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Material with Novel Compositions and Fine Microstructljres Produced Via the Mixalloy Process

Published online by Cambridge University Press:  21 February 2011

Arthur K. Lee ,
Luis E. Sanchez-Caldera ,
Jung-Hoon Chun  and
Nam P. Suh
Arthur K. Lee
Affiliation:
Sutek Corporation, 14 Brent Drive, Hudson, MA 01749
Luis E. Sanchez-Caldera
Affiliation:
Sutek Corporation, 14 Brent Drive, Hudson, MA 01749
Jung-Hoon Chun
Affiliation:
Sutek Corporation, 14 Brent Drive, Hudson, MA 01749
Nam P. Suh
Affiliation:
MIT, Dept. of Mechanical Engineering, 77 Mass. Ave., Cambridge, MA 02139
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Abstract

A new processing method, the Mixalloy process, has been developed to process alloys with novel microstructures and compositions. In this process, microstructural control is achieved through the use of turbulent mixing of liquid metals in addition to controlling solidification rate and chemical composition. Boride dispersion strengthened copper alloys were produced using the Mixalloy process. Thermally stable and fine (average less than 100 nm) boride dispersoids were formed by in-situ chemical reaction in the copper alloy matrices during mixing. The uniform mixture of the matrix and dispersoids was then rapidly solidified to maintain the fine microstructure. The consolidated material shows exceptional thermal stability and an excellent combination of strength, ductility, and electrical conductivity. Furthermore, the flexibility of the process allows the matrices of these dispersion strengthened coppers to be easily alloyed to fulfill specific needs. The versatility and simplicity of the Mixalloy process provide an economical alternative to other processing means in the manufacturing of high performance alloys such as dispersion strengthened alloys.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 132: Symposium G – Multicomponent Ultrafine Microstructures , 1988 , 87
Copyright
Copyright © Materials Research Society 1989

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References

REFERENCES

[1] Suh, N. P., ASME Journal of Engineering for Industry, 104, 327, (1982).Google Scholar
[2] Suh, N. P., Tsuda, N., Moon, M. G., Saka, N., ASME Journal of Engineering for Industry, 104, 332, (1982).CrossRefGoogle Scholar
[3] Suh, N. P., U.S. Patent No. 4 278 622 (14 July 1981).Google Scholar
[4] Suh, N. P., U.S. Patent No. 4 279 843 (21 July 1981).Google Scholar
[5] Sanchez-Caldera, L. E., Suh, N. P., Chun, J-H, Lee, A. K., Blackall, F. S. IV, U.S. Patent No. 4 706 730 (17 November 1987).Google Scholar
[6] Tucker, C. L. and Suh, N. P., Polymer Engineering and Science, 3 (13), 875, (1980).CrossRefGoogle Scholar
[7] Nguyen, L. T., “Processing of Interpenetrating Polymer Networks by Reaction Injection Molding”, Ph.D. Thesis, Mechanical Engineering Dept., MIT, Cambridge, 1984.Google Scholar
[8] Nadkarni, A. V., Klar, E. and Shefer, W. M., Metals Engineering Quarterly, 10, August 1976.Google Scholar