Hostname: page-component-8448b6f56d-mp689 Total loading time: 0 Render date: 2024-04-19T12:54:24.367Z Has data issue: false hasContentIssue false

Material Characterization Of Methyl Siloxane Sogs

Published online by Cambridge University Press:  15 February 2011

Ken Numata
Affiliation:
Semiconductor Process and Device Center, Texas Instruments Inc., Dallas, TX 75265 Present Address: Texas Instruments Japan, ULSI Technology Center, Kihara 2350, Miho, Inashiki, Ibaraki, Japan
Thomas R. Seha
Affiliation:
Semiconductor Process and Device Center, Texas Instruments Inc., Dallas, TX 75265
Shin-Puu Jeng
Affiliation:
Semiconductor Process and Device Center, Texas Instruments Inc., Dallas, TX 75265
Tsuyoshi Tanaka
Affiliation:
Texas Instruments Tsukuba R & D Center, Miyukigaoka 17, Tsukuba, Ibaraki, 305 Japan
Get access

Abstract

Methyl siloxane spin-on-glass (SOG) is a conventional gap-filling material. In accordance with the requirement of low permittivity, many of major SOG suppliers are developing new types of methyl siloxane SOGs.

The most interesting property of these SOGs is their permittivity, which we measured by making stack structures of Al-0.5%Cu / TEOS CVD SiO2 / SOG / n+ Si. We also studied I-V characteristics, refractive indices, FT-IR spectra, stress, and moisture resistance.

All of the SOGs showed small stress and fair moisture resistance. Leakage currents were less than 2.5E-10 A/cm2 for bias voltages up to 5V. Permittivities ranged from 2.9 to 3.6. We observed a correlation between permittivity and FT-IR spectral features associated with Si-O-Si bonds. Reducing the number density of Si-O-Si bonds may be an effective way to lower the permittivity of this class of SOGs

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Nakano, T., presented at Symposium “Interlayer Dielectrics Processing to Fabricate Multilevel Metallization Applied for the Next Generation ULSI”, Tokyo, Japan, 1994 (unpublished).Google Scholar
2. Leu, J., Lee, J.K., Liao, C.N., Kasthurirangan, J. and Ho, P.S., presented at the 1995 MRS Spring Meeting, San Francisco, CA, 1995 (unpublished)Google Scholar
3. Ip, Flora and Ting, Chiu, presented at the 1995 MRS Spring Meeting, San Francisco, CA, 1995 (unpublished).Google Scholar
4. Fukada, T. and Akahori, T., presented at the 1993 International Conference on Solid State Devices and Materials, Makuhari, Japan, 1993 (unpublished)Google Scholar
5. Usami, T., Shimokawa, K. and Yoshimura, M., Jpn. J. Appl. Phys. 33, 408 (1994).Google Scholar
6. Lipp, E. D. and Smith, A. Lee, in The Analytical Chemistry of Silicones, edited by Smith, A. Lee (Wiley Interscience, New York, 1991), p. 328.Google Scholar
7. Nishikida, K. and Iwamoto, R., Material Analysis by IR Method (in Japanese) (Kodansha, Tokyo, 1986), p. 229.Google Scholar