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Material and Interface Characterization of Cu99Ti1 Thin Films Metallized on Polyimide

  • E. Kondoh (a1) and T.P. Nguyen (a2)


Copper films with a small amount of an alloy element (1 wt % Ti) were metallized on polyimide. Plasma pre-treatment of the polyimide surface and post-metallization annealing were used to modify the interface. Interfaces and metal film layers were investigated; a drastic increase in adhesion strength, the suppression of Cu diffusion into polyimide, and the improvement of (111) texture were found. Composition analysis data taken from the interface indicated the accretion of nitrogen at the interface. The formation of Ti-related chemical bonds, suggested by X-ray photoelectron spectroscopy, can explain the above-mentioned experimental results.



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[1] Gupta, D., Faupel, F., and Willecke, R., in Diffusion in amorphous materials, Eds., Gupta, H.J.a.D., (The minerals, metals & materials Society, Pittsburgh, PA, 1993), pp. 189.
[2] Hu, C.-K., Small, M.B., Kaufman, F., and DPearson, J., in Tungsten and Other Advanced Metals for VLSI/ULSI Applications V, Eds., Wong, S.S. and Furukawa, S., (Materials Research Socity, Pittburg, PA, 1989), pp. 369.
[3] Cabrai, J. C., Harper, J.M., Holloway, K., Smith, D.A., and Schad, R.G., J. Vac. Sci. Technol. A10, 1706(1992).
[4] Ding, P.J., Lanford, W.A., Hymes, S., and Murarka, S.P., J. Appl. Phys. 75, 3627 (1994).
[5] Knorr, D.B., and Rodbell, K.P., J. Appl. Phys. 79, 2409 (1996).
[6] Inagaki, N., Tasaka, S., and Hibi, K., J. Adhesion Sci. Technol. 8, 395 (1994).
[7] Paik, K.W., Ruoff, A.L., in Adehsion in Solids, Eds., Mattox, D. M., Baglin, J. E. E., Gottschall, R. J., Batich, C. D., (Mater. Res. Soc. Proc. 119, Pittsburg, PA, 1988), p. 271.
[8] LeGoues, F.K., Silverman, B.D., and Ho, P.S., J. Vac. Sci. Technol. A6, 2200 (1988).
[9] Kondoh, E., Nguyen, T.P., Plachke, D.W., Carstanjenc, H., and Arzt, E., Appl. Phys. Lett., 10. 1251 (1997).
[10] Ghijsen, J., Tjeng, L.H., Elp, J.v., Eskes, H., Westerink, J., Sawatsky, G.A., and Czyzyk, M.T., Phys. Rev. B38, 11322 (1988).
[11] Ohuchi, F.S., Tjeng, L.H., Elp, J. v., Eskes, H., Westerink, J., Sawatsky, G.A., and Czyzyk, M.T., Phys. Rev. B38, 11322 (1988).
[12] Wagner, C.D., Riggs, W.M., Davis, L.E., Moulder, J.F., and Muilenberg, G.E., Handbook of X-ray Photoelectron Spectroscopy, (Perkin Elmer Corporation, Eden Prairie, Minnesota, 1978).
[13] Milosev, I., Strehblow, H.-H, Navinsek, B., and Metikos-Hukovic, M., Surface and Interface Analysis, 23, 529 (1995).
[14] Zielinski, E. M., Vinci, R. P., and Bravman, J. C., Appl. Phys. Lett., 67, 1078 (1995).


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