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Magnetic Aftereffect in Compositionally-Modulated Ni/Cu Multilayers Prepared by Electrodeposition and by Sputtering

Published online by Cambridge University Press:  28 February 2011

L.H. Bennett
Affiliation:
National Institute of Standards and Technology, Gaithersburg, MD 20899
L.J. Swartzendruber
Affiliation:
National Institute of Standards and Technology, Gaithersburg, MD 20899
U. Atzmony*
Affiliation:
National Institute of Standards and Technology, Gaithersburg, MD 20899
D.S. Lashmore
Affiliation:
National Institute of Standards and Technology, Gaithersburg, MD 20899
W. Abdul-Razzaq
Affiliation:
West Virginia University, Morgantown, WV 26506
*
Permanent address: Department of Physics, Nuclear Research Center, Negev, P.O. Box 9001, Beer-Sheva, Israel
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Abstract

A relaxation of the magnetization following a rapid change in the magnetic field has been found in a compositionally-modulated Ni/Cu multilayer produced by sputtering. This finding demonstrates that the relaxation previously found in compositionally-modulated alloys produced by electrodeposition is a property of the material and not an artifact of the electrodeposition process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

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