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Low Temperature Preparation of Gallium Nitride Thin Films

  • Roy G. Gordon (a1), David M. Hoffman (a1) and Umar Riaz (a2)

Abstract

Gallium nitride thin films were prepared by atmospheric pressure chemical vapor deposition from hexakis(dimethylamido)digallium, Ga2(NMe2)6, and ammonia precursors at substrate temperatures of 100–400 °C with growth rates up to 1000 Å/min. The films were characterized by transmission electron microscopy, X-ray photoelectron spectroscopy, Rutherford backscattering spectrometry and forward recoil spectrometry. The N/Ga ratio varied from 1.05 for films deposited at 400 °C to 1.5 at 100 °C. The hydrogen concentration increased from 10 atom % for films deposited at 400 °C to 24 atom % at 100 °C. Films deposited at 100 °C were amorphous but films deposited at higher temperatures were polycrystalline. Bandgaps of the films varied from 3.8 eV for films deposited at 400 °C to 4.2 eV at 100 °C.

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Low Temperature Preparation of Gallium Nitride Thin Films

  • Roy G. Gordon (a1), David M. Hoffman (a1) and Umar Riaz (a2)

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