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Low Temperature Deposition of Transparent Ultra Water-Repellent Thin Films by Microwave Plasma Enhanced Chemical Vapor Deposition

Published online by Cambridge University Press:  17 March 2011

Yunying Wu ,
Yasushi Inoue ,
Hiroyuki Sugimura  and
Osamu Takai
Yunying Wu
Affiliation:
Department of Materials Processing EngineeringNagoya University, Nagoya 464-8603, JAPAN Aichi Science & Technology Foundation, Nagoya 460-0002, Japan, wu@plasma.numse.nagoya-u.ac.jp
Yasushi Inoue
Affiliation:
Department of Materials Processing EngineeringNagoya University, Nagoya 464-8603, JAPAN
Hiroyuki Sugimura
Affiliation:
Department of Materials Processing EngineeringNagoya University, Nagoya 464-8603, JAPAN
Osamu Takai
Affiliation:
Department of Materials Processing EngineeringNagoya University, Nagoya 464-8603, JAPAN
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Abstract

One of the most common methods for obtaining water repellent surfaces is spreading fluoropolymer or fluoroalkylsilane onto substrates. However, this method is not applicable to low heat-resistant substrates such as plastics, since after spreading, the method requires a heating process which is generally conducted at a temperature of about 600K. The objective of this study is the preparation of ultra water-repellent and optically transparent thin films at low temperatures below 373K. The films were deposited by means of microwave plasma enhanced plasma chemical vapor deposition (MPECVD) using organosilane, that is, trimethylmethoxysilane (TMMOS) as a source with adding Ar, CO2, N2, O2 or air as an excitation gas. Under optimized preparation conditions, films with water contact angles more than 150 degrees and optical transparencies more than 90% were successfully fabricated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 711: Symposia FF/GG/HH – Advanced Biomaterials--Characterization, Tissue Engineering and Complexity , 2001 , HH3.28.1
Copyright
Copyright © Materials Research Society 2002

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References

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