Hostname: page-component-76fb5796d-45l2p Total loading time: 0 Render date: 2024-04-25T16:41:41.468Z Has data issue: false hasContentIssue false
  • English
  • Français

Low Stress, High Resolution Photosensitive Polyimide Based on a BPDA/PDA/6FDAm Copolymer

Published online by Cambridge University Press:  15 February 2011

Marie Angelopoulos ,
Jeff Gelorme ,
Sally Swanson  and
Jeff Labadie
Marie Angelopoulos
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Jeff Gelorme
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Sally Swanson
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120
Jeff Labadie
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120
Get access

Abstract

A novel series of BPDA/PDA/6FDAm polyimide copolymers have been developed. These materials are more flexible, soluble, and more optically transparent than the homopolymer BPDA/PDA. A negative acting PSPI has been developed based on one of these copolymers. This PSPI exhibits high resolution. 6 μm lines can be delineated in a 19 μm thick film. In addition, the PSPI exhibits high performance mechanical/physical properties such as a low CTE, low stress, and high elongation at break.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 259
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Soane, D.S. and Martynenko, Z., Polymers in Microelectronics (Elsevier Science Publishers, New York, 1989).Google Scholar
2. Mittal, K., Polyimides: Synthesis, Characterization, and Applications, (Plenum Press, New York, 1984).Google Scholar
3. Feger, C., Khojasteh, M.M., and McGrath, J.E., Polyimides: Materials, Chemistry, and Characterization, (Elsevier Science Publishers, New York, 1989).Google Scholar
4. Feger, C., Khojasteh, M.M., Htoo, M. S., Advances in Polyimide Science and Technology (Technomic Publishing Co., 1993).Google Scholar
5. Rubner, R., Ahne, H., Kuhn, E., and Kolodziej, G., Photographic Sci. Eng., 23, 5, 303 (1979).Google Scholar
6. Pfeifer, J. and Rohde, O., in Recent Advances in Polyimide Science and Technology, ed. by Weber, W. and Gupta, M. (Society of Plastics Engineers, New York, 1987) p. 336.Google Scholar
7. Conference Preprints from “Photopolymers: Principles, Processes, and Materials, Ellenville New York, 1991. pp. 329–416.Google Scholar
8. Mittal, K.L., Polyimides: Synthesis, Characterization, and Applications, (Plenum Press, New York, 1984), pp. 905–954.Google Scholar
9. Moore, J. A., and Dasheff, A.N. in Polyimides: Materials, Chemistry, and Characterization, ed. by Feger, C., Khojasteh, M., and McGrath, J. (Elsevier Science Publishing Company, New York 1989), p.115.Google Scholar
10. Some of the values quoted were measured in our laboratories.Google Scholar
11. Numata, S., Kinjo, N., and Makino, D., Polym. Eng. Sci., 28, 906 (1988).CrossRefGoogle Scholar
12. Schuckert, C.C., Fox, G.B., Merriman, B.T., Proc. Electrochem. Soc., 89–3, 116 (1989).Google Scholar
13. Fischer, W., Finter, J., and Zweiferl, H., US Patent No. 4681950 (21 July 1987); J. Gelorme, IBM Patent Pending, 1993.Google Scholar
14. Clair, A.K. St., Clair, T.L. St., and Slemp, W.S., in Recent Advances in Polyimide Science and Technology, ed. by Weber, W.D. and Gupta, M.R. (Society of Plastics Engineers, New York, 1987) p. 16.Google Scholar
15. Reuter, R., Franke, H., and Feger, C., Applied Optics, 27, 4565 (1988) and references therein.Google Scholar
16. Beuhler, A., Wargowski, D. A., Kowalczyk, T., and Singer, K.D., Proceedings from SPIE, Optoelectronic Interconnects, 1849, 92,1993.CrossRefGoogle Scholar
17. Angelopoulos, M., Gelorme, J., Labadie, J., and Swanson, S., IBM Patent Pending, 1993; M. Angelopoulos, J. Gelorme, J. Labadie, and S. Swanson, IBM Patent Pending, 1993, Proceedings of 5th Meeting of DuPont Symposium on High Density Interconnect and Thin Film Polyimide Technology, Oct. 1993.Google Scholar