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Low Stress, High Reflectivity Thin Films for MEMS Mirrors

Published online by Cambridge University Press:  01 February 2011

Yoosuf N. Picard ,
David P. Adams ,
Olga B. Spahn ,
Steven M. Yalisove ,
Daryl J. Dagel  and
Joseph Sobczak
Yoosuf N. Picard
Affiliation:
Sandia National LaboratoriesAlbuquerque, NM 87105 Materials Science and Engineering Dept., University of Michigan Ann Arbor, MI 48109
David P. Adams
Affiliation:
Sandia National LaboratoriesAlbuquerque, NM 87105
Olga B. Spahn
Affiliation:
Sandia National LaboratoriesAlbuquerque, NM 87105
Steven M. Yalisove
Affiliation:
Materials Science and Engineering Dept., University of Michigan Ann Arbor, MI 48109
Daryl J. Dagel
Affiliation:
Sandia National LaboratoriesAlbuquerque, NM 87105
Joseph Sobczak
Affiliation:
Sandia National LaboratoriesAlbuquerque, NM 87105
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Abstract

Au/Cr and Au/Ti films were deposited on Si (100) substrates using DC planar magnetron sputtering to assess residual stress in high reflectivity coatings. The dependence of stress on argon sputter pressure, component materials, and film thickness is discussed. Stress evolution as a function of thickness for individual Cr, Ti and Au films is also investigated to identify high-stress components of these two-layer coatings. Near-zero stress Au/Ti films were achieved with a particular set of sputtering parameters. Using the same process conditions, films were deposited onto pre-released MEMS mirrors having a number of different shapes and sizes. Optical interferometry demonstrates minimal change in the bow of 500, 250, and 125 μm diameter mirrors, consistent with a λ/40 flatness (λ = 1319 nm).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 729: Symposium U – MEMS and BioMEMS , 2002 , U3.11
Copyright
Copyright © Materials Research Society 2002

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