Hostname: page-component-848d4c4894-8bljj Total loading time: 0 Render date: 2024-07-08T00:00:35.303Z Has data issue: false hasContentIssue false
  • English
  • Français

Lead-free (Ba,Ca)(Zr,Ti)O3 Based Electrocaloric Devices: Challenges and Perspectives

Published online by Cambridge University Press:  17 July 2013

Gunnar Suchaneck  and
Gerald Gerlach
Gunnar Suchaneck
Affiliation:
Solid State Electronics Laboratory, TU Dresden, 01062 Dresden, Germany
Gerald Gerlach
Affiliation:
Solid State Electronics Laboratory, TU Dresden, 01062 Dresden, Germany
Get access

Abstract

In this work, we analyze the requirement to (Ba,Ca)(Zr,Ti)O3 thin films for applications in electrocaloric devices. We demonstrate that large temperature changes are realized mostly independent of the used material by applying sufficient electric fields. Ferroelectrics exhibiting a diffuse phase transition are beneficial for electrocaloric applications, but they change the range of operational temperatures.

Keywords

dielectric propertieselectrical propertiesceramic
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1581: Symposium CCC – Novel Functionality by Reversible Phase Transformation , 2013 , mrss13-1581-ccc03-03
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Thompson, Sir W., Phil. Mag. Fifth Ser. 5–28, §29 (1878).CrossRefGoogle Scholar
Kobeko, P. and Kurtschatov, J.. Z. Phys. 66, 192–205 (1930).CrossRefGoogle Scholar
Roberts, S., Phys. Rev. 85, 925–926 (1952).CrossRefGoogle Scholar
Tuttle, B. A. and Payne, D. A., Ferroelectrics. 37, 603–606 (1981).CrossRefGoogle Scholar
Sinyavsky, Y.V. and Brodyansky, V.M., Ferroelectrics, 131, 321–325 (1992).CrossRefGoogle Scholar
Mischenko, A.S., Zhang, Q., Scott, J.F., Whatmore, R.W. and Mathur, N.D., Science. 311, 1270–1271 (2006).CrossRefGoogle Scholar
Bai, Y., Zheng, G.-P., Ding, K., Qiao, L., Shi, S.-Q., Guo, D., J. Appl. Phys. 110, 094103 (2011).Google Scholar
Kar-Narayan, S. and Mathur, N.D., J. Phys. D: Appl. Phys. 43, 032002 (2010).CrossRefGoogle Scholar
Lu, S.-G. and Zhang, Q., Adv. Mater. 21, 1983–1987 (2009).CrossRefGoogle Scholar
Birks, E., Dunce, M. and Sternberg, A., Ferroelectrics. 400, 336–343 (2010).CrossRefGoogle Scholar
Scott, J., Annu. Rev. Mater. Res. 41, 229–240 (2011).CrossRefGoogle Scholar
Valant, M., Prog. Mater. Sci. 57, 980–1009 (2012).CrossRefGoogle Scholar
Lines, M.E. and Glass, A.M., Principles and Applications of Ferroelectrics and Related Materials, (Oxford: Clarendon Press, 1977).Google Scholar
Clarke, R. and Burfoot, J. C., Ferroelectrics. 8, 505–506 (1974).CrossRefGoogle Scholar
Uchino, K. and Nomura, S., Ferroelectrics. 44, 55–61 (1982).CrossRefGoogle Scholar
Santos, I.A. and Eiras, J.A., J. Phys.: Condens. Matter. 13, 11733 (2001).Google Scholar
Kirillov, V. V. and Isupov, V. A., Ferroelectrics. 5, 3–9 (1973).CrossRefGoogle Scholar
Lawless, W.N., Phys. Rev. B. 16, 433–439 (1977).CrossRefGoogle Scholar
Wiseman, G.G., IEEE Trans. Electron. Dev. ED-16, 588-593 (1969).CrossRefGoogle Scholar
Johnson, K.M., J. Appl. Phys. 33, 2826–2831 (1962).CrossRefGoogle Scholar
Karchevskii, A.I., Fiz. Tverd. Tela. 3, 3092–3099 (1961).Google Scholar
Rožič, B., Kosec, M., Uršič, H., Holc, J., Malič, B., Zhang, Q. M., Blinc, R., Pirc, R. and Kutnjak, Z., J. Appl Phys. 110, 064118 (2011).CrossRefGoogle Scholar
Lawless, W.N., Solid-State Electrocaloric refrigeration. (CeramPhysics Inc., 2003).Google Scholar
Ravez, J. and Simon, A., Ferroelectrics. 240, 1579–1586 (2000).CrossRefGoogle Scholar
Bokov, A.A., Bing, Y.-H., Chen, W., Ye, Z.-G., Bogatina, S.A., Raevski, I.P., Raevskaya, S.I., and Sahkar, E.V., Phys. Rev. B. 68, 052102 (2003).CrossRefGoogle Scholar
Herbert, J.M., Proc. IEE 112, 1474–1477 (1965).Google Scholar
Sakabe, Y., Minai, K. and Wakino, K., Jpn. J. Appl. Phys. 20S4, 147-150 (1981).CrossRefGoogle Scholar
Kishi, H., Mizuno, Y. and Chazono, H., Jpn. J. Appl. Phys. 42, 1–15 (2003).CrossRefGoogle Scholar
Ju, Y.S., J. Electron. Packag. 132, 041004 (2010).CrossRefGoogle Scholar
Yang, G.Y., Dickey, E.C., Randall, C.A., Barber, D.E., Pinceloup, P., Henderson, M.A., Hill, R.A., Beeson, J.J., and Skamser, D.J., J. Appl. Phys. 96, 7492–7499 (2004).CrossRefGoogle Scholar
Lee, S., Randall, C.A. and Liu, Z.-K., J. Am. Ceram. Soc. 91, 1748–1752 (2008).CrossRefGoogle Scholar
Beauger, A., Mutin, J.C. and Niepce, J.C., J. Mater. Sci. 19, 195–201, (1984).CrossRefGoogle Scholar
Lee, J.-K., Hong, K.-S. and Jang, J.-W., J. Am. Ceram. Soc. 84, 2001–2006 (2001).CrossRefGoogle Scholar
Vidyarthi, V.S., Lin, W.-M., Suchaneck, G., Gerlach, G., Thiele, C. and Hoffmann, V., Thin Solid Films. 515, 3547–3553 (2007).CrossRefGoogle Scholar