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Lateral Spreading of Au Contacts on InP

Published online by Cambridge University Press:  25 February 2011

Navid S. Fatemi  and
Victor G. Weizer
Navid S. Fatemi
Affiliation:
Sverdrup Technology, Inc., Lewis Research Center Group, 21000 Brookpark Rd., Cleveland, Oh 44135
Victor G. Weizer
Affiliation:
NASA Lewis Research Center, 21000 Brookpark Rd., Cleveland, OH 44135
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Abstract

We have investigated the contact spreading phenomenon observed when small area Au contacts on InP are annealed at temperatures above about 400 C. We have found that the rapid lateral expansion of the contact metallization which consumes large quantities of InP during growth is closely related to the third stage in the series of solid state reactions that occur between InP and Au, i.e., to the AU3In-to-AugIn4 transition. We present detailed descriptions of both the spreading process and the Au3In-to-AugIn4 transition along with arguments that the two processes are manifestations of the same basic phenomenon.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 181: Symposium B – Advanced Metallizations in Microelectronics , 1990 , 417
Copyright
Copyright © Materials Research Society 1990

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References

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