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Laser Trim Revisited in the Light of an Excimer Lasera

Published online by Cambridge University Press:  25 February 2011

Michel Gauthier ,
Richard Bourret ,
Gerard Gavrel  and
Richard Carnegie
Michel Gauthier
Affiliation:
Laser Chemistry Group, Division of Chemistry, National Research Council of Canada, Ottawa, Canada, K1A 0R6
Richard Bourret
Affiliation:
NRC Summer Student 1988
Gerard Gavrel
Affiliation:
Network Access Division, Northern Telecom Canada Limited, P.O. Box 1000, Aylmer, Québec, Canada, J9H 5M6
Richard Carnegie
Affiliation:
Network Access Division, Northern Telecom Canada Limited, P.O. Box 1000, Aylmer, Québec, Canada, J9H 5M6
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Abstract

In the Laser Chemistry Group's program aimed at understanding the basic mechanisms involved in the fabrication and characterization of integrated circuits, we have converted an infrared laser-based, thick film trimming technique, which is over 15 years old, to UV light. It is known that excimer lasers can be used for microfabrication of semiconductors and ceramics. Much cleaner ablations than those obtainable with the infrared lasers have been demonstrated in a large variety of materials. This, together with the fact that excimers with repetition rates over 1 kHz are presently on the market, leads us to propose that better accuracies and smaller drifts, should be achievable using excimer laser-based thick film hybrid circuit trimming. Results of XeCl laser trimming of over four hundred resistors, including temperature coefficient of resistance measurements and life tests at elevated temperatures, demonstrate that UV trimming is a factor of 10 better than the presently used infrared process.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 129: Symposium B – Laser and Particle-Beam Modification of Chemical Processes on Surfaces , 1988 , 621
Copyright
Copyright © Materials Research Society 1989

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Footnotes

a

Issued as NRCC # 29822

References

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