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Laser Processing of Parmod™ Functional Electronic Materials

Published online by Cambridge University Press:  10 February 2011

Paul H. Kydd
Affiliation:
Parelec, Inc., 5 Crescent Ave. P.O. Box 236, Rocky Hill, NJ 08553
David L. Richard
Affiliation:
Parelec, Inc., 5 Crescent Ave. P.O. Box 236, Rocky Hill, NJ 08553
Douglas B. Chrisey
Affiliation:
Naval Research Laboratory, 4555 Overlook Ave. SW, Washington, DC 20375
Kenneth H. Church
Affiliation:
CMS Technetronics, 5202-2 N. Richmond Hill Rd., Stillwater, OK 74075
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Abstract

Parmod™ is a family of materials that can be printed and thermally cured to create metallic conductors on printed wiring boards. This additive process provides a way to produce circuitry direct from CAD files without the necessity for intermediate tooling of any kind. The printed images are converted to pure metallic traces in seconds at a temperature low enough to be compatible with commonly used rigid and flexible polymer-based substrates. This simple, two-step process eliminates the hazardous wastes and employee health and safety issues associated with conventional plate-and-etch photolithographic technology

Recently the Parmod™ technology has been extended from metals to oxides to enable printing passive electronic components such as resistors, capacitors and inductors, as well as the metallic interconnects. While thermal curing of the oxides provides useable electronic properties, particularly of resistors and capacitors, the performance of all these novel materials could be improved by laser processing. This paper discusses preliminary results on laser processing of Parmod™ conductors and components in two different systems

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

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