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Kinetics of Cavity Growth In Solder Joints During Thermal Cycle
Published online by Cambridge University Press: 22 February 2011
Abstract
Grain boundary cavity growth in solder joints during thermal fatigue is analyzed. The stress cycle profile is estimated based on a geometrically simplified model of a ceramic chip carrier - printed circuit board assembly and a state variable equation for plastic flow in the solder.
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- Copyright © Materials Research Society 1985
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