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Ion Track Enabled High Aspect Ratio Flexible PCB Via Technology

Published online by Cambridge University Press:  01 February 2011

Mikael Lindeberg ,
Hanna Yousef ,
Erik Öjefors ,
Anders Rydberg  and
Klas Hjort
Mikael Lindeberg
Affiliation:
Dept. of Engineering Sciences, The Ångström Laboratory, Uppsala University Box 534, SE-751 21 Uppsala, Sweden
Hanna Yousef
Affiliation:
Dept. of Engineering Sciences, The Ångström Laboratory, Uppsala University Box 534, SE-751 21 Uppsala, Sweden
Erik Öjefors
Affiliation:
Dept. of Engineering Sciences, The Ångström Laboratory, Uppsala University Box 534, SE-751 21 Uppsala, Sweden
Anders Rydberg
Affiliation:
Dept. of Engineering Sciences, The Ångström Laboratory, Uppsala University Box 534, SE-751 21 Uppsala, Sweden
Klas Hjort*
Affiliation:
Dept. of Engineering Sciences, The Ångström Laboratory, Uppsala University Box 534, SE-751 21 Uppsala, Sweden
*
* corresponding author's e-mail: klas.hjort@angstrom.uu.se
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Abstract

By combining ion track technology with ordinary low-resolution printed circuitboard lithography it is possible at low cost to create high aspect ratios via connectors, as solid plugs or consisting of bundles of sub-micron connector wires at a small total cross-section.

Ion track enabled microwave circuits in flexible printed circuit boards are suggested to be used in applications like inductors, ferromagnetic resonance microwave filters, circulators and magnetoresistive sensors. In this paper we demonstrate this technology with integrated printed circuitboard devices in two different flexible polyimide-based foils (Espandex and Kapton HN), using the ultra-high-density vias and the sub-micron wires.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 833: Symposium G – Materials, Integration, and Packaging Issues for High-Frequency Devices II , 2004 , G7.7
Copyright
Copyright © Materials Research Society 2005

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References

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