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Investigation of Inherently Conductive Polymer as Structure Health Monitoring Sensor for Composite

Published online by Cambridge University Press:  17 June 2011

Huaxiang Yang
Affiliation:
Crosslink, 46 Shelby Thames Drive, Hattiesburg MS 39402, U.S.A
Dongsik Kim
Affiliation:
Crosslink, 46 Shelby Thames Drive, Hattiesburg MS 39402, U.S.A
Abhishek K. Singh
Affiliation:
Crosslink, 46 Shelby Thames Drive, Hattiesburg MS 39402, U.S.A
Brady W. Pitts
Affiliation:
Crosslink, 46 Shelby Thames Drive, Hattiesburg MS 39402, U.S.A
Gregory J. Tregre
Affiliation:
Crosslink, 46 Shelby Thames Drive, Hattiesburg MS 39402, U.S.A
Patrick J. Kinlen
Affiliation:
Crosslink, 950 Bolger Court, St. Louis, MO 63026, U.S.A
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Abstract

A soluble polyaniline was synthesized through emulsion polymerization and characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), gel permeation chromatography (GPC), viscosity analysis, and coefficient of linear thermal expansion (CLTE) determination. The electrical conductivity is found to reach 1000 S/cm with specific post doping treatments. Multiple printing processes, such as inkjet printing, screen printing and aerosol jet printing etc, make it feasible to print a variety of sensor patterns. The electromechanical response of these sensors was used to measure strain/stress or damage of composite structures under various load conditions expected to be experienced by aircraft. These unique conductive polymer sensors provide a feasible, near real time monitoring system for composites without adding significant additional weight to the structure.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1. Palaniappan, S., John, A., Prog. Polym. Sci. 33, 732758 (2008).Google Scholar
2. Kinlen, P.J., Liu, J., Ding, Y., Graham, C. R., Remsen, E. E., Macromolecules 31, 17351744 (1998).Google Scholar
3. Kim, J.Y., Lee, J.H., Kwon, S.J., Synth. Met. 157, 336342 (2007).Google Scholar
4. Bhadra, S., Chattopadhyay, S., Singha, N.K., Khastgir, D., J. Appl. Polym. Sci. 108, 5764 (2008).Google Scholar
5. Lin, M., Chang, F.-K., Compos. Sci. Tech. 62, 919939 (2002).Google Scholar
6. Verma, R.K., Kander, R.G., Hsiao, B.S., J. Mater. Sci. Lett. 13, 438442 (1994).Google Scholar
7. Sjogren, A., Krasnikovs, A., Varna, J.. Compos. Part A 32, 12371242 (2001).Google Scholar
8. Park, Joung-Man, Kim, Dae-Sik, Kim, Sung-Ju, Kim, Pyung-Gee, Yoon, Dong-Jin, and Lawrence DeVries, K., Compos. Part B 38, 847-861 (2007); 37, 612-626 (2006).Google Scholar
9. Broitman, E., Alonso, P., Aragon, R., and Zimmerman, R., Adv. Mat. Sci. & Tech. 1, 1316 (1996).Google Scholar
10. Kuang, K. S. C., Cantwell, W. J., J. Thermoplast. Compos. Mater. 16, 213229 (2003).Google Scholar
11. Chopra, I., AIAA Journal 20, 21452187 (2002).Google Scholar
12. Daoud, W.A., Xin, J. H., Szeto, Y.S., Sens. Actuators B 109, 329333 (2005).Google Scholar
13. Kinlen, P. J., Yang, H., Kim, D., Singh, A. K., Pitts, B., Patent No. US 2010095781 (2010).Google Scholar
14. Singh, A.K., Kim, D., Yang, H., Pitts, B. W., Tregre, G.J., Kinlen, P.J., SAMPLE, 2009, Wichita, KS, Oct 19-22, 2009.Google Scholar
15. Kim, D., Singh, A.K., Yang, H., Pitts, B. W., Tregre, G.J., Kinlen, P.J., ASME 2009, Oxnard, CA, Sept 21–23, 2009.Google Scholar
16. Kim, Y.-G., Viswanathan, S., Mbugua, J., Jung, J.-H., Kinlen, P.J., Proc. of 18th Int. Seminar on Double Layer Capacitors & Hybrid Energy Storage Devices 218223 (2008).Google Scholar
17. Lux, F., Polymer 35 (14), 29152936 (1994).Google Scholar
18. Cardoso, M.J.R., Lima, M.F.S., Lenz, D.M., Materials Research 10 (4), 425429 (2007).Google Scholar
19. Ding, L., Wang, X., Gregory, R.V., Synth. Met. 104, 7378 (1999).Google Scholar