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Interaction of Cu and CoSi2

  • C. L. Shepard (a1), W. A. Lanford (a1), Y-T. Shy (a2) and S. Murarka (a2)

Abstract

Interaction of thin film Cu and CoSi2 has been studied using Rutherford backscattering spectroscopy and sheet resistance measurements. For temperatures ≤ 600° C. , no measurable diffusion of Cu into CoSi2 is observed.

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References

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1. Murarka, S.P., J. Vac. Sci. Technol. B4, 1325, (1986).
2. Maissel, L.I., in “Handbook of Thin Film Technology”, Editors: Maissel, L.I. and Glang, R., (McGraw-Hill, NY, 1970), p. 1321.
3. Hansen, M., “Composition of Binary Alloys”, (McGraw-Hill, NY, 1958), p. 469.
4. Bean, J.C. and Poate, J.M., Appl. Phys. Lett. 37, 203 (1980)

Interaction of Cu and CoSi2

  • C. L. Shepard (a1), W. A. Lanford (a1), Y-T. Shy (a2) and S. Murarka (a2)

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