- Cited by 4
-
Cited byCrossref Citations
This article has been cited by the following publications. This list is generated based on data provided by CrossRef.
Kaloyeros, A. E. Dettelbacher, C. Eisenbraun, E. T. Lanford, W. A. Li, H. Olowolafe, J. F. Murarka, S. Pintchovski, F. Shy, Y. -T. and Toscano, P. J. 1991. The Effect of Grain Boundaries and Substrate Interactions with Hydrogen on the CVD Growth of Device-Quality Copper.. MRS Proceedings, Vol. 229, Issue. ,
Shy, Y. -T. Murarka, S. P. Sitaram, A. R. Ding, P.-J. and Lanford, W. A. 1992. Interactions and Stability of Cu on CoSi2. MRS Proceedings, Vol. 260, Issue. ,
Murarka, S.P. 1994. The effect of hydrogenous species on the properties and reliability of the dielectrics and metals used in multilevel metallization. p. 8-1-1.
Murarka, Shyam P. and Hymes, Steven W. 1995. Copper metallization for ULSL and beyond. Critical Reviews in Solid State and Materials Sciences, Vol. 20, Issue. 2, p. 87.
Interaction of Cu and CoSi2
-
- DOI: https://doi.org/10.1557/PROC-181-105
- Published online by Cambridge University Press: 25 February 2011
Abstract
Interaction of thin film Cu and CoSi2 has been studied using Rutherford backscattering spectroscopy and sheet resistance measurements. For temperatures ≤ 600° C. , no measurable diffusion of Cu into CoSi2 is observed.
Copyright
COPYRIGHT: © Materials Research Society 1990
References
- Cited by 4
-
Cited byCrossref Citations
This article has been cited by the following publications. This list is generated based on data provided by CrossRef.
Kaloyeros, A. E. Dettelbacher, C. Eisenbraun, E. T. Lanford, W. A. Li, H. Olowolafe, J. F. Murarka, S. Pintchovski, F. Shy, Y. -T. and Toscano, P. J. 1991. The Effect of Grain Boundaries and Substrate Interactions with Hydrogen on the CVD Growth of Device-Quality Copper.. MRS Proceedings, Vol. 229, Issue. ,
Shy, Y. -T. Murarka, S. P. Sitaram, A. R. Ding, P.-J. and Lanford, W. A. 1992. Interactions and Stability of Cu on CoSi2. MRS Proceedings, Vol. 260, Issue. ,
Murarka, S.P. 1994. The effect of hydrogenous species on the properties and reliability of the dielectrics and metals used in multilevel metallization. p. 8-1-1.
Murarka, Shyam P. and Hymes, Steven W. 1995. Copper metallization for ULSL and beyond. Critical Reviews in Solid State and Materials Sciences, Vol. 20, Issue. 2, p. 87.
Interaction of Cu and CoSi2
-
- DOI: https://doi.org/10.1557/PROC-181-105
- Published online by Cambridge University Press: 25 February 2011
