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Integration Challenges for Chemical Mechanical Polishing of Cu/Low-κ Interconnects

  • Jeffrey A. Lee (a1), Mansour Moinpour (a2), Huey-Chiang Liou (a2) and Thomas Abell (a3)

Abstract

The drive for improved performance of microelectronic devices has led to the prevalence of copper metallization and the aggressive development of low-permittivity (low-κ) dielectric materials for use as interlayer dielectrics in BEOL interconnect structures. Progressive scaling of metal line widths coupled with the need to incorporate ultra low-κ (ULK) dielectrics, with κ<2.2, presents numerous challenges for integration and reliability. Perhaps the most significant challenge for the 90nm technology node and beyond is successful planarization of Cuinterconnect structures by chemical mechanical polishing (CMP). The present paper will discuss the general integration challenges and key structural reliability issues for chemical mechanical polishing of Cu-interconnects incorporating ULK dielectric materials.

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1.International Technology Roadmap of Semiconductors; ITRS Home Page, http://public.itrs.net/Files/2001ITRS/Home.htm
2. Moinpour, M. Tregub, A. Oehler, A. and Cadien, K. MRS Bulletin, October (2002), pp 766771
3. Singh, R.K. Lee, S. Choi, K. Basim, G. Choi, W. Chen, Z. and Moudgil, B.M. MRS Bulletin, October (2002)
4. Tregub, A. and Moinpour, M. AVS 3rd Int. Conf. On Microelectronics and Interfaces, Santa Clara, Ca (February), 2002
5. Singer, P. Semiconductor International, (2000)
6. Nguyen, J. Marten, G. Carpio, R. Grief, M. and Joshi, S. Mat. Res. Soc. Symp. Proc. Vol. 732E, (2002) pp I1.4.18
7. Lee, J.A. Wetzel, J.T. Noakes, A. Buchanan, K. McNeil, J. and Beekmann, K, AVS Microelectronics Conference, (February), Santa Clara, 2002
8. Small, R. Carter, M. and Pete, M. Advancing Applications in Contamination Control, January (2001)
9. Block, Kelly H. and Rayle, Heather L. Semiconductor International, (2002)
10. Bajaj, R. Zutshi, A. Surana, R. Naik, M. and Pan, T. MRS Bulletin, October 2002, pp776–78
11. Miller, A. Fischer, P.B. Feller, A., Cadien, K. IEEE (2001)
12. Moinpour, M. and Liou, Huey-chiang, un-published data.
13. Havemann, R. H. and Hutchby, James A. Proceedings of the IEEE, Vol 89, NO. 5, May 2001
14. Kloster, G. Scherban, T. Xu, G. Blaine, J. Sun, B. and Zhou, Y. IITC Proceedings, p. (2002)
15. Lin, S. IITC Proceedings, (2000)
16. Lee, J. Wetzel, J. T., Ho, P.S. and Merrill, C., Spring MRS 2002, April, San Francisco, CA, (2002)
17. Ahlburn, B.T, Gallagher, M. Gronbeck, D. Prokopowicz, G. Sullivan, C. Gidley, D. Kastenmeier, B., and Lee, J.A. Advanced Metallization Conference, (October), San Diego, (2002)
18. Iacopi, A F., Patz, M. Vos, I. Tokei, Zs. Sijmus, B. Le, Q.T. Sleeckx, E. Eyckens, B. Struyf, H., Maex, K. Materials for Advanced Metallization Conference 2003
19. Tsai, S. Chen, L. Sun, L. R.Mavliev, Hsu, W. Xia, L. and Morad, R., IITC Proceedings (2002)
20. Evans, D. MRS Proceedings, Vol 732E (2002)
21. Hanzono, M. Amanokura, J. and Kamigata, Y. MRS Bulletin, October (2002) pp 772–75
22. Fury, M. Levert, J. Mukherjee, S. and DeBear, D. ECS Hawaii Proceedings, October (1999).

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Integration Challenges for Chemical Mechanical Polishing of Cu/Low-κ Interconnects

  • Jeffrey A. Lee (a1), Mansour Moinpour (a2), Huey-Chiang Liou (a2) and Thomas Abell (a3)

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