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In-situ Study on Effects of Annealing Temperature and Mo Interlayer on Stress Relaxation Behaviors of Pure Al Films on Glass Substrates

  • Young-Bae Park (a1), Soo-Jung Hwang (a2), Yong-Duk Lee (a3), Ja-Young Jung (a4) and Young-Chang Joo (a5)...

Abstract

The in-situ SEM observation of real-time hillock evolution in pure Al thin films on glass substrate during isothermal annealing at 194°C was analyzed quantitatively to understand the compressive stress relaxation mechanism by focusing on the effect of Mo interlayer between Al film and glass substrate. There is a good correlation between the hillock-induced stress relaxation and the measured stress relaxation by wafer curvature method. It is also clearly shown that the existence of Mo interlayer plays an important role in hillock formation probably due to the large difference in interfacial diffusivity of Al films.

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