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In-Situ Measurement of Bending Strength of TiC Whiskers in the Scanning Electron Microscope

Published online by Cambridge University Press:  15 February 2011

Yutaka Seino ,
Shoichiro Shin  and
Satoshi Nagai
Yutaka Seino
Affiliation:
National Research Laboratory of Metrology, 1–4 Umezono 1–chome, Tsukuba, Ibaraki 305, Japan
Shoichiro Shin
Affiliation:
National Research Laboratory of Metrology, 1–4 Umezono 1–chome, Tsukuba, Ibaraki 305, Japan
Satoshi Nagai
Affiliation:
National Research Laboratory of Metrology, 1–4 Umezono 1–chome, Tsukuba, Ibaraki 305, Japan
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Abstract

The three–point bending strength of TiC whiskers was measured in a scanning electron microscope. The whisker samples have ∼ 50µm length and 2∼4µm diameter and are commercially available as reinforcements for composite materials. The distribution of the bending strengths of the whiskers showed a double peak around 5.2GPa and 30.4GPa, respectively. The difference in these values is attributed to differences in the cleavage strength of two crystal planes depending on whisker growth direction.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 365: Symposium M – Ceramic Matrix Composites–Advanced High-Temperature Structural Materials , 1994 , 35
Copyright
Copyright © Materials Research Society 1995

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