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Influence of Solute Additions on Electromigration in Aluminum

Published online by Cambridge University Press:  15 February 2011

Choong-Un Kim ,
J. W. Morris Jr. ,
F. Y. Génin  and
M. J. Fluss
Choong-Un Kim
Affiliation:
Center for Advanced Materials, Lawrence Berkeley National Laboratory and Department of Materials Science, University of California, Berkeley
J. W. Morris Jr.
Affiliation:
Center for Advanced Materials, Lawrence Berkeley National Laboratory and Department of Materials Science, University of California, Berkeley
F. Y. Génin
Affiliation:
Chemistry and Materials Science, Lawrence Livermore National Laboratory Livermore, CA.
M. J. Fluss
Affiliation:
Chemistry and Materials Science, Lawrence Livermore National Laboratory Livermore, CA.
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Abstract

This study investigates the effect of solute additions on electromigration in Al-based thin film binary alloys. The “cross-strip” technique was used to observe solute electromigration and its influence on Al electromigration. The results of electromigration tests on five alloy additions, Ag, Au, Cu, Pd and Ni, are presented. It is concluded that beneficial solutes have two characteristics. First, they have a large, negative effective valence (Z**). Second, they have sufficient solubility in Al at test temperature to provide a reservoir of mobile atoms. Ag and Au are relatively ineffective because of their low effective valence. Pd and Ni appears to be relatively ineffective because of their low solubility at test temperature. Only Cu satisfies both criteria.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 213
Copyright
Copyright © Materials Research Society 1996

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