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Influence of Silicon Incorporation on the Properties of Hard a-C:H Films

Published online by Cambridge University Press:  22 February 2011

A.L. Baia Neto
Affiliation:
Depto. de Engenharia Metalurgica e de Materiais, COPPE, Universidade Federal do Rio de Janeiro, Cx. Postal 68505, Rio de Janeiro, RJ, Brazil
R.A. Santos
Affiliation:
Depto. de Engenharia Metalurgica e de Materiais, COPPE, Universidade Federal do Rio de Janeiro, Cx. Postal 68505, Rio de Janeiro, RJ, Brazil
F.L. Freire Jr.
Affiliation:
Depto. de Fisica, PUC-Rio, Rio de Janeiro, Brazil
W. Beyer
Affiliation:
ISI-PV, KFA-Jülich, Jülich, Germany
S.S. Camargo Jr
Affiliation:
Depto. de Engenharia Metalurgica e de Materiais, COPPE, Universidade Federal do Rio de Janeiro, Cx. Postal 68505, Rio de Janeiro, RJ, Brazil
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Abstract

- Results on the properties of silicon incorporated hard a-C:H films deposited on the cathode of a glow discharge decomposition system using methane and silane gaseous mixtures are reported. Obtained samples showed an increased deposition rate, high hardness comparable to that of a-C:H, and a large decrease of the internal stress upon silicon incorporation. The structure of the samples seems to be similar to diamond-like a-C:H, as revealed by the total hydrogen content, infrared absorption and hydrogen effusion experiments. Our results indicate that the observed reduction of residual internal stress may be attributed to a less compact material and/or to a smaller density of voids containing hydrogen in comparison to pure a-C:H.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

[1] Angus, J.C. and Hayman, C.C., Science 241, 913 (1988).Google Scholar
[2]Amorphous and microcrystalline semiconductor devices: optoelectronic devices” ed. by Kanicki, J. (Artech House, Norwood, 1991).Google Scholar
[3] Beyer, W., J. Non-Cryst. Solids 97&98, 1367 (1987).Google Scholar
[4] Oguri, K. and Arai, T., Thin Solid Films 208, 158 (1992).Google Scholar
[5] Oguri, K. and Arai, T., J. Mater. Res. 5, 2567 (1990).Google Scholar
[6] Demichelis, F., Giachello, G., Pirri, C.F. and Tagliaferro, A., Proceedings of the 10th European Photovoltaic Solar Energy Conference, Lisbon, 1991, p. 125.Google Scholar
[7] Smeets, J., Meneve, J., Jacobs, R., Eersels, L. and Dekempeneer, E., J. de Physique IV, Colloque C3, 503 (1993).Google Scholar
[8] Franceschini, D.F., Achete, C.A. and Freire, F.L. Jr., Appl. Phys. Lett. 60, 3229 (1992).Google Scholar
[9] Jiang, X., Beyer, W. and Reichelt, K., J. Appl. Phys. 68, 1378 (1990).Google Scholar
[10] Leidich, D., Schuhenr, A., Umbach, H.-G., Niemann, E. and Beyer, W., Diamond Rel. Mater. 1, 1169 (1992).Google Scholar
[11] Franceschini, D.F., Achete, C.A., Freire, F.L. Jr., Beyer, W. and Marioto, G., Diamond Rel. Mater. 3, 88 (1993).Google Scholar
[12] Grill, A. and Patel, V., Diamond Rel. Mater. 2, 1519 (1993).Google Scholar