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Indentation Delamination and Indentation Fracture in ZnO/Si Systems

Published online by Cambridge University Press:  15 March 2011

Bin Huang ,
Ming-Hao Zhao  and
Tong-Yi Zhang
Bin Huang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
Ming-Hao Zhao
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
Tong-Yi Zhang*
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
*
a)Corresponding author, Tel. (852) 2358-7192, Fax (852) 2358-1543, E-mail: mezhangt@ust.hk
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Abstract

Vickers indentation tests were carried out at room temperature with a microhardness tester on ZnO thin films deposited on (100) Si wafers. The films with thicknesses ranging from 0.202 to 1.535 νm were tested under indentation loads varying from 50 mN to 2.0 N. The experiments exhibited a film thickness dependent deformation behavior. When the film thickness is smaller than a critical value, only indentation-induced radical cracking occurred and for a given load, the radical crack size decreased with film thickness. On the other hand, indentation-induced delamination was observed if the film thickness was larger than the critical value. In this case, the radial crack, if induced, had a size smaller than the size of delamination or even smaller than the size of indentation impression. Under a same indentation load, the delamination size increased with the film thickness.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microelectromechanical Systems (MEMS) Devices IV , 2001 , B5.14
Copyright
Copyright © Materials Research Society 2002

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