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Indentation Creep of Molybdenum: Comparison Between Thin Film and Bulk Material

Published online by Cambridge University Press:  21 February 2011

K. B. Yoder ,
D. S. Stone ,
J. C. Lin  and
R. A. Hoffmann
K. B. Yoder
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin-Madison
D. S. Stone
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin-Madison
J. C. Lin
Affiliation:
Surface Technology Division, ALCOA Research Center, Alcoa Park, PA.
R. A. Hoffmann
Affiliation:
Surface Technology Division, ALCOA Research Center, Alcoa Park, PA.
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Abstract

Indentation creep, load relaxation, and rate-change experiments probe room temperature and 80°C creep properties of a 1.3 μm-thick molybdenum film on silicon. The film, with 0.51 GPa compressive stress, 8 GPa hardness and estimated 40 nm grain size, was deposited using steered-arc evaporation at -17V bias. Despite its small grain size and high hardness, the thin film behaves like bulk molybdenum does: the rate sensitivity of the hardness is only weakly-dependent on measurement path (as with bulk material), and activation volumes calculated based on strain rate sensitivity are consistent with those of bulk molybdenum We suspect deformation mechanisms are similar to those in bulk molybdenum under similar conditions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 651
Copyright
Copyright © Materials Research Society 1995

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References

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