Hostname: page-component-77c89778f8-7drxs Total loading time: 0 Render date: 2024-07-17T16:55:12.808Z Has data issue: false hasContentIssue false

High-Power Characteristics of GaN/InGaN Double Heterojunction Bipolar Transistors with a Regrown p-InGaN Base Layer

Published online by Cambridge University Press:  01 February 2011

Toshiki Makimoto
Affiliation:
NTT Basic Research Laboratories, NTT Corporation 3–1 Morinosato Wakamiya, Atsugi-shi, Kanagawa 243–0198, Japan
Yoshiharu Yamauchi
Affiliation:
NTT Basic Research Laboratories, NTT Corporation 3–1 Morinosato Wakamiya, Atsugi-shi, Kanagawa 243–0198, Japan
Kazuhide Kumakura
Affiliation:
NTT Basic Research Laboratories, NTT Corporation 3–1 Morinosato Wakamiya, Atsugi-shi, Kanagawa 243–0198, Japan
Get access

Abstract

We have investigated high-power characteristics of GaN/InGaN double heterojunction bipolar transistors on SiC substrates grown by metalorganic vapor phase epitaxy. The p-InGaN extrinsic base layers were regrown to improve ohmic characteristics of the base. Base-collector diodes showed low leakage current at their reverse bias voltages due to a wide bandgap of a GaN collector, resulting in a high-voltage transistor operation. A 90 μm × 50 μm device operated up to a collector-emitter voltage of 28 V and a collector current of 0.37 A in its common-emitter current-voltage characteristics at room temperature, which corresponds to a DC power of 10.4 W. A collector current density and a power density are as high as 8.2 kA/cm2 and 230 kW/cm2, respectively. These results show that nitride HBTs are promising for high-power electronic devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Makimoto, T., Kumakura, K. and Kobayashi, N., phys. stat. sol. (c) 0, No. 1, 95, (2002).Google Scholar
2. Makimoto, T., Kumakura, K. and Kobayashi, N., 29th International Symposium on Compound Semiconductors 2002 (ISCS 2002), Th–C–4, Lausanne, Switzerland (2002).Google Scholar
3. Zolper, J. C., Solid-State Electron., 42, 2153 (1998).Google Scholar
4. Makimoto, T., Kumakura, K. and Kobayashi, N., J. Cryst. Growth 221, 350 (2000).Google Scholar
5. Makimoto, T., Kumakura, K. and Kobayashi, N., 2003 Solid State Devices and Materials (SSDM 2003), F–2–2, Tokyo (2003). To be published in Jpn. J. Appl. Phys. Google Scholar
6. Makimoto, T., Kumakura, K. and Kobayashi, N.: The Fifth International Conference on Nitride Semiconductors (ICNS-5), Fr–A12.6, Nara (2003).Google Scholar
7. Makimoto, T., Kumakura, K. and Kobayashi, N., Appl. Phys. Lett. 83, 1035 (2003).Google Scholar
8. Makimoto, T., Kumakura, K. and Kobayashi, N., 61st Annual Device Research Conference (2003 DRC), II.A–5, Salt Lake City (2003).Google Scholar
9. Makimoto, T., Kumakura, K., and Kobayashi, N., Appl. Phys. Lett. 79, 380 (2001).Google Scholar
10. Makimoto, T., Kumakura, K. and Kobayashi, N.: MRS Proceedings, volume 639, G13.10.1 © 2001 Materials Research Society.Google Scholar
11. Tiwari, S., Wright, S. L., and Kleinsasser, A. W., IEEE Trans. Electron Devices, ED–34, 185 (1987).Google Scholar
12. Makimoto, T., Kurishima, K., Kobayashi, T., and Ishibashi, T., IEEE Electron Device Lett. 12, 369 (1991).Google Scholar