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High-Current Reliability of Carbon Nanofibers for Interconnect Applications

Published online by Cambridge University Press:  01 February 2011

Hirohiko Kitsuki ,
Makoto Suzuki ,
Quoc Ngo ,
Kristofer Gleasson ,
Alan M. Cassell ,
Yusuke Ominami ,
Christopher R. Moylan ,
Jun Li  and
Cary Y. Yang
Hirohiko Kitsuki
Affiliation:
HKitsuki@scu.edu, Santa Clara University, Center for Nanostructure, 500 El Camino Real, Santa Clara, CA, 95035, United States
Makoto Suzuki
Affiliation:
M1Suzuki@scu.edu, Santa Clara University, Center for Nanostructures, Santa Clara, CA, 95053, United States
Quoc Ngo
Affiliation:
ngoqx@hotmail.com, Santa Clara University, Center for Nanostructures, Santa Clara, CA, 95053, United States
Kristofer Gleasson
Affiliation:
joequser@yahoo.com, Santa Clara University, Center for Nanostructures, Santa Clara, CA, 95053, United States
Alan M. Cassell
Affiliation:
acassell@arc.nasa.gov, NASA Ames Research Center, Center for Advanced Aerospace Materials and Devices, Moffett Field, CA, 94035, United States
Yusuke Ominami
Affiliation:
ominami-yusuke@naka.hitachi-hitec.com, Santa Clara University, Center for Nanostructures, Santa Clara, CA, 95053, United States
Christopher R. Moylan
Affiliation:
cmoylan@stanford.edu, University of California-Santa Cruz, Department of Electrical Engineering, Santa Cruz, CA, 95064, United States
Jun Li
Affiliation:
jli@mail.arc.nasa.gov, NASA Ames Research Center, Center for Advanced Aerospace Materials and Devices, Moffett Field, CA, 94035, United States
Cary Y. Yang
Affiliation:
CYang@scu.edu, Santa Clara University, Center for Nanostructures, Santa Clara, CA, 95053, United States
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Abstract

We present a high-current reliability study of carbon nanofibers (CNFs) for interconnect applications. In situ scanning transmission electron microscopy (STEM) reveals structural damage to CNFs after current stress. The effect of heat dissipation on the current capacity is also discussed by using different experimental configurations. Long-time reliability tests are performed with a vertical via interconnect structure, showing promising high reliability of CNF interconnects for future electronic devices.

Keywords

nanostructureelectrical propertiesscanning electron microscopy (SEM)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1018: Symposium EE – Applications of Nanotubes and Nanowires , 2007 , 1018-EE10-07
Copyright
Copyright © Materials Research Society 2007

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