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High Yield Polymer MEMS Process for CMOS/MEMS Integration

Published online by Cambridge University Press:  20 January 2011

Prasenjit Ray ,
V. Seena ,
Prakash R. Apte  and
Ramgopal Rao
Prasenjit Ray
Affiliation:
Centre of Excellence in Nanoelectronics, Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India.
V. Seena
Affiliation:
Centre of Excellence in Nanoelectronics, Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India.
Prakash R. Apte
Affiliation:
Centre of Excellence in Nanoelectronics, Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India.
Ramgopal Rao
Affiliation:
Centre of Excellence in Nanoelectronics, Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India.
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Abstract

MEMS community is increasingly using SU-8 as a structural material because it is self-patternable, compliant and needs a low thermal budget. While the exposed layers act as the structural layers, the unexposed SU-8 layers can act as the sacrificial layers, thus making it similar to a surface micromachining process. A sequence of exposed and unexposed SU-8 layers should lead to the development of a SU-8 based MEMS chip integrated with a pre-processed CMOS wafer. A process consisting of optical lithography to obtain SU-8 structures on a CMOS wafer is described in this paper.

Keywords

polymerstructuralcomposite
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1299: Symposium S – Microelectromechanical Systems—Materials and Devices IV , 2011 , mrsf10-1299-s04-12
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1. Vora, K D, Shew, B Y, Harvey, E C, Hayes, J P and Peele, A G J. Micromech. Microeng. 15 978 (2005).CrossRefGoogle Scholar
2. Jiang, K, Lancaster, M J, Llamas-Garro, I. and Jin, P. J. Micromech. Microeng. 15, 1522 (2005)CrossRefGoogle Scholar
3. Williams, J D and Wang, W Microsyst.Technol. 10, 694 (2004)CrossRefGoogle Scholar
4. Zhang, J, Chan-Park, M B and Conner, S R Lab on a Chip 4 646 (2004)CrossRefGoogle Scholar
5. Chang, H-K. and Kim, Y-K. Sensors Actuators A 84, 342 (2000)CrossRefGoogle Scholar
6. Gammelgaard, L., Rasmussen, P. A., Calleja, M., Vettiger, P., and Boisen, A. Appl. Phy. Lett 88, 113508(2006)CrossRefGoogle Scholar
7. Seena, V, Anukool, Rajorya, Prita, Pant, Mukherji, S, Ramgopal Rao, V Solid State Science, 11, 1606 (2009)CrossRefGoogle Scholar
8. Prashant, Mali, Aniruddh, Sarkar, Rakesh, Lal, Lab on Chip 6 310 (2006)Google Scholar
9. Ceyssens, F, Puers, R J Micromech. Microeng. 16(6) 19(2006)CrossRefGoogle Scholar
10. Seidemann, V, Rabe, J, Feldmann, M and Buttgenbach, S Microsyst. Technol. 8 348(2002)CrossRefGoogle Scholar
11. Bertsch, A, Lorenz, H and Renaud, P Sensors Actuators A 73 14(1999)CrossRefGoogle Scholar
12. Chuang, Y-J, Tseng, F-G, Cheng, J-H and Lin, W-K Sensors Actuators A 103 64(2003)CrossRefGoogle Scholar
13. Tay, F. H., Kan, J. A., Watt, F., Choong, W. O. J. Micromech. Microeng 11(1) 27 (2000).CrossRefGoogle Scholar
14. Foulds, I G and Parameswaran, M J. Micromech. Microeng. 16, 2109 (2006)CrossRefGoogle Scholar