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Growth, crystal structure and stability of Ag-Ni/Cu films

Published online by Cambridge University Press:  01 February 2011

I. K. Bdikin
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia Department of Ceramics and Glass Engineering and Center for Research in Ceramic and Composite Materials (CICECO), University of Aveiro, 3810–193, Aveiro, Portugal
G. K. Strukova
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
G.V. Strukov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
V.V. Kedrov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
D.V. Matveev
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
S. A. Zver'kov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
A. L. Kholkin
Affiliation:
Department of Ceramics and Glass Engineering and Center for Research in Ceramic and Composite Materials (CICECO), University of Aveiro, 3810–193, Aveiro, Portugal
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Abstract

AgxNi1−x (x=0.0–1.0) films were grown on Cu substrates by electrodeposition method. The films were found to be a nanocrystalline mixture of pure silver and nickel. The grain sizes were determined by X-ray diffraction and electron microscopy techniques. The minimal value was 3.3 nm for the alloy with 70 wt% Ni concentration. The stability of the grown films upon heating in air and in vacuum was examined. An increase in the grain size was found to begin at 150 °C.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

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