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Full Field Measurements of Curvature using Coherent Gradient Sensing: Application to Thin Film Characterization

Published online by Cambridge University Press:  10 February 2011

A. J. Rosakis ,
R. P. Singh ,
Y. Tsuji ,
E. Kolawa  and
N. R. Moore Jr
A. J. Rosakis
Affiliation:
Department of Aeronautics, California Institute of Technology, Pasadena, CA 91125
R. P. Singh
Affiliation:
Department of Aeronautics, California Institute of Technology, Pasadena, CA 91125
Y. Tsuji
Affiliation:
Department of Applied Physics, California Institute of Technology, Pasadena, CA 91125
E. Kolawa
Affiliation:
Department of Applied Physics, California Institute of Technology, Pasadena, CA 91125
N. R. Moore Jr
Affiliation:
Jet Propulsion Laboratory, Pasadena, CA 91109
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Abstract

This paper introduces coherent gradient sensing (CGS) as an optical, full-field, real-time, non-intrusive and non-contact technique for measurement of curvature and curvature changes in thin film and micro-mechanical structures. The technique is applied to determine components of the curvature tensor field in multilayered thin films deposited on silicon wafers. Curvature field measurements using CGS are compared with average curvatures obtained using high-resolution x-ray diffraction. Finally, examples are presented to demonstrate the capability of CGS in measuring curvature in a variety of thin film and micro-mechanical structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 15
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.Seidel, T., Zhao, B., Materials Research Society Proceedings, 427, 3 (1996).Google Scholar
2.Nix, W. D., Metallurgical Transactions, 20A, 2217 (1989).Google Scholar
3.Li, C. -Y., Totta, P. and Ho, P., Eds., Stress Induced Phenomena in Metallization: First International Workshop, AlP Conference Proceeding, 263, (1992).Google Scholar
4.d′Heurle, F. M., Int. Mat. Rev., 34, 53 (1989).Google Scholar
5.Klema, J., Pyle, R. and Domangue, E., Proceedings of the 22nd Annual IEEE International Reliability Physics Symposium, 1 (1984).Google Scholar
6.Tokunaga, K. and Sugawara, K., Journal of the Electrochemical Society, 138(1), 176 (1991).Google Scholar
7.McPherson, J. W. and Dunn, C. F., Journal of Vacuum Science and Technology, B5(5), 1321, (1987).Google Scholar
8.Yost, F. G., Scripta Metallurgica, 23, 1323, (1989).Google Scholar
9.Sauter, A. I. and Nix, W. D., Materials Research Society Proceedings, 188, 153 (1990).Google Scholar
10.Ryan, J. G., Riendeau, J. B., Shore, S. E., Slusser, G. J., Beyar, D. C., Bouldin, D. P. and Sullivan, T. D., Journal of Vacuum Science and Technology, B9, 1474 (1990).Google Scholar
11.Tanikawa, A. and Okabayashi, H., Proceedings of the 28th Annual IEEE International Reliability Physics Symposium, 194 (1990).Google Scholar
12.Moske, M. A., Ho, P. S., Hu, C. K. and Small, M. B., Proceedings of the First International Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 195 (1992).Google Scholar
13.Borgesen, P., Korhonen, M. A., Brown, D. D. and Li, C. -Y., Proceedings of the First International Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 219 (1992).Google Scholar
14.Korhonen, M. A., Borgese, P. and Li, C. -Y., Proceedings of the First International Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 29 (1992).Google Scholar
15.Sulliva, T. D., Miller, L. and Endicott, G., Proceedings of the First International Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 136 (1992).Google Scholar
16.Blech, I. A., IEEE International Reliability Physics Symposium Tutorials, 1986.Google Scholar
17.Guste, P. B., Solid State Technology, 20, 113 (1983).Google Scholar
18.Ho, P. S. and Kwok, T., Reports on Progress in Physics, 52, 301 (1989).Google Scholar
19.Hoang, H. H. and McDavid, J. M., Solid State Technology, 11, 5 (1988).Google Scholar
20.Vaidya, G., Fraser, D. B. and Lindenberger, W. S., Journal of Applied Physics, 51, 4475 (1980).Google Scholar
21.Lloyd, J. R., Smith, P. M. and Prokop, G. S., Thin Solid Films, 93, 385 (1982).Google Scholar
22.Gardner, D. S., Meindl, J. D. and Saraswat, K. C., IEEE Transactions on Electronic Devices, 34(3), 633 (1987).Google Scholar
23.Danso, K. A. and Tullos, L., Microelectronics and Reliability, 21, 513 (1981).Google Scholar
24.Cullity, B. D., Elements of X-ray Diffraction (Addison-Wesley Publishing Company, Reading, MA 1978).Google Scholar
25.Vreeland, T., Dommann, A., Tsai, C. -J. and Nicolet, M. -A., Materials Research Society Proceedings, 30, 3 (1988).Google Scholar
26.Flinn, P. A., Gardner, D. S. and Nix, W. D., IEEE Transactions on Electronic Devices, 34, 689 (1987).Google Scholar
27.Stoney, G. G., Proceedings of the Royal Society, London, Series A, 82, 172 (1909).Google Scholar
28.Finot, M. and Suresh, S., Journal of the Mechanics and Physics of Solids, 44(5), 683 (1996).Google Scholar
29.Freund, L. B., Journal of Crystal Growth, 132, 341 (1993).Google Scholar
30.Freund, L. B., Journal of the Mechanics and Physics of Solids, 44(5), 723, (1996).Google Scholar
31.Born, M. and Wolf, E., Principles of Optics (Pergamon Press, New York, 1986).Google Scholar
32.Park, S., Dadkhah, M. S. and Motamedi, E., Abstract Proceedings of the VII International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, 7, (1996).Google Scholar
33.Han, B. and Guo, Y., Experimental/Numerical Mechanics in Electronic Packaging, 1,1, (1996).Google Scholar
34.Lee, Y. J., Lambros, J. and Rosakis, A. J., Optics and Lasers in Engineering, 25(1), 25 (1996).Google Scholar
35.Weller, T. M., Katehi, L. P., Herman, M. I. and Wamhof, P. D., IEEE Transactions on Microwave Theory and Techniques, 2, 911 (1994).Google Scholar
36.Rosakis, A. J., Singh, R. P., Tsuji, Y., Kolawa, E. and Moore, N. R. Jr., Thin Solid Films. (In Press)Google Scholar