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Formation Process of a Rhenium-Based Diffusion Barrier on a Nickel-Based Superalloy

Published online by Cambridge University Press:  26 February 2011

Yongming Wang
Affiliation:
wang@eng.hokudai.ac.jp, Hokkaido University, Materials Science Division, N-13, W-8, Kita-Ku, Sapporo, 060-8628, Japan
Somei Ohnuki
Affiliation:
Ohnuki@eng.hokudai.ac.jp, Graduate School of Engineering, Materials Science Division, N-13, W-8, Kita-Ku, Sapporo, 060-8628, Japan
Toshio Narita
Affiliation:
narita@eng.hokudai.ac.jp, Graduate School of Engineering, Materials Science Division, N-13, W-8, Kita-Ku, Sapporo, 060-8628, Japan
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Abstract

The formation process of Rhenium-based diffusion barrier coating on Nickel-based superalloy has been investigated in present paper. The diffusion barrier can be formed by two steps, electroplating and Cr cementation. A tri-layer film structure consisting of Ni / Re~63Ni~37 / Ni was prepared by electrolytic plating onto the substrate of a Ni-based single-crystal superalloy, it was found that the Re-Ni plating film composed of amorphous alloy which is characterized by X-ray diffraction (XRD) analysis. The changes of the barrier films which formed by followed Cr-Pack cementations at 1573 K for 20 min, 50 min, 240 min, 360 min and 600 min, respectively, were investigated by Scan Electron Microscope (SEM) and Electron Probe Micro Analyzer (EPMA). Changing in the thickness of barrier film exhibited two stages, and the composition of barrier film changed along the curve of solubility limit of Ni in Re-Ni-Cr sigma phase.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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