Skip to main content Accessibility help
×
Home

Formation of Intermetallics and Grain Boundary Diffusion in Cu-Al and Au-Al Thin Film Couples *

  • J. M. Vandenberg (a1), F. J. A. Den Broeder (a1) and R. A. Hamm (a1)

Extract

An in situ annealing X-ray study was applied to Cu-Al thin film couples over a wide range of copper-to-aluminum film ratios. This new technique, which has been previously described for a study on the Au-Al thin film system, enables us to make a temperature-dependent photographic X-ray analysis. The present study indicated that only a limited number of the wide variety of bulk phases form in the Cu-Al thin film interface, while some of these phases in the interface are transient. In the transient stages of the interface reaction, the f.c.c.-ordered phase β-Cu3A1 grows over the entire range of copper-to-aluminum film ratios after the first nucleation of CuA12, indicating a two-step nucleation reaction. On the aluminum-rich side, this phase transforms to a new ordered hexagonal phase β′. It could be interpreted as a superlattice of the metastable hexagonal ω phase occurring in zirconium-based alloys. The end phases are CuA1 and CuAl2.

Copyright

Footnotes

Hide All

Permanent address: Philips Research Laboratories, Eindhoven, The Netherlands.

*

Extended abstract of a paper presented at the Symposium on Thin Films and Interfaces, Boston, MA, U.S.A., November 16–19, 1981.

Footnotes

References

Hide All
1 Vandenberg, J. M. and Hamm, R. A., J. Vac. Sci. Technol., 19 (1981) 84.
2 Vandenberg, J. M. and Hamm, R. A., Thin Solid Films, to be published.
3 den Broeder, F. J. A., Vandenberg, J. M. and Klerk, M., Acta Metall., to be published.
4 den Broeder, F. J. A., Acta Metall., 20 (1972) 319.
5 Cahn, J. W., Pan, J. D. and Baluffi, R. W., Scr. Metall., 13 (1979) 503.
6 Hansen, M. and Anderko, K. A., Constitution of Binary Alloys, McGraw-Hill, London, 1958.
7 Tousek, J., Kokove Mater., 12 (1974) 561;
Diffus. Data, 12 (1976) 25.
8 Tu, K. N., J. Appl. Phys., 48(1977) 3400.
9 Hillert, M. and Purdy, G., Acta Metall., 26 (1978) 333.
10 Baluffi, R. W. and Cahn, J. W., Acta Metall., 29 (1981) 493.
11 Smith, D. A. and King, A. H., Philos. Mag. A, 44 (1981) 333.
12 Matthews, J. W. and Jesser, W. A., J. Vac. Sci. Technol., 6 (1969) 641.
13 Matthews, J. W., Thin Solid Films, 25 (1975) 199.
14 Mittemeijer, E. J. and Beers, A. M., Thin Solid Films, 65 (1980) 125.
15 den Broeder, F. J. A. and Nakahara, S., to be published.
16 Matsuno, N. and Oikawa, H., Metall. Trans., A, 6 (1975) 2191.

Formation of Intermetallics and Grain Boundary Diffusion in Cu-Al and Au-Al Thin Film Couples *

  • J. M. Vandenberg (a1), F. J. A. Den Broeder (a1) and R. A. Hamm (a1)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed