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Fluidic Surface-Tension-Directed Self-Assembly of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies

  • Heiko Jacobs (a1) and Robert J Knuesel (a2)


This proceeding discusses recent progress on engineered fluidic surface-tension-directed self-assembly involving liquid solder. The process is applied to the assembly of discrete inorganic semiconductor device components at different length scales producing electrically interconnected devices and systems. Prior results include assembly with unique angular orientation and contact pad registration, parallel packaging, and the programmable assembly of various types of light emitting diodes. Recent progress on the scaling of the minimal die size from 300 to 30 μm is discussed which required the development of a new delivery system to concentrate and effectively introduce the components to solder-based receptors. Specifically, components are pre-oriented at a liquid-air or liquid-liquid interface and transferred onto the solder based receptors using a dynamic contact angle with a dipping process. Recent applications include the tiling of curved and 3D surfaces with single crystal semiconductors including the formation of flexible 3D solar cells.



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[1] Cohn, M. B. Bohringer, K. F. Noworolski, J. M. Singh, A. Keller, C. G. Goldberg, K. Y. Howe, R. T. Proceedings of SPIE 1998, 3512, 2.
[2] Clark, T. D. Tien, J. Duffy, D. C. Paul, K. E. Whitesides, G. M. Journal of the American Chemical Society 2001, 123, 7677.
[3] Fearing, R. S. Proceedings 1995, 212.
[4] Zhang, S. Nature Biotechnology 2003, 21, 1171.
[5] Whitesides, G. M. Grzybowski, B. Science 2002, 295, 2418.
[6] Yeh, H. J. J. Smith, J. S. IEEE Photonics Technology Letters 1994, 6, 706.
[7] Smith, J. S. Yeh, H. J. J. US Patent 1998, 5,824,186.
[8] Gracias, D. H. Tien, J. Breen, T. L. Hsu, C. Whitesides, E. M. Science 2000, 289, 1170.
[9] Boncheva, M. Gracias, D. H. Jacobs, H. O. Whitesides, G. M. Proc. Natl. Acad. Sci. USA 2002, 99, 4937.
[10] Jacobs, H. O. Tao, A. R. Schwartz, A. Gracias, D. H. Whitesides, G. M. Science 2002, 296, 323.
[11] Srinivasan, U. Liepmann, D. Howe, R. T. Journal of Microelectromechanical Systems 2001, 10, 17.
[12] Srinivasan, U. Helmbrecht, M. A. Rembe, C. Muller, R. S. Howe, R. T. IEEE Journal of Selected Topics in Quantum Electronics 2002, 8, 4.
[13] Böhringer, K. F., Srinivasan, U. Howe, R. T. Interlaken, Switzerland, 2001.
[14] Zheng, W. Buhlmann, P. Jacobs, H. O. Proc. Natl. Acad. Sci. USA 2004, 101, 12814.
[15] Zheng, W. Jacobs, H. O. Applied Physics Letters 2004, 85, 3635.
[16] Zheng, W. Jacobs, H. O. Advanced Functional Materials 2005, 15, 732.
[17] Patolsky, F. Zheng, G. Lieber, C. M. Analytical Chemistry 2006, 78, 4260.
[18] Jacobs, H. O. Wei, Z. USA, Provisional Application, March 2006.
[19] Barry, C. R. Jacobs, H. O. Nano Letters 2006, 6, 2790.
[20] Xiong, X. Hanein, Y. Fang, J. Wang, Y. Wang, W. Schwartz, D. T. Bohringer, K. F. Journal of Microelectromechanical Systems 2003, 12, 117.
[21] Stauth, S. A. Parviz, B. A. Proceedings of the National Academy of Sciences of the United States of America 2006, 103, 13922.


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Fluidic Surface-Tension-Directed Self-Assembly of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies

  • Heiko Jacobs (a1) and Robert J Knuesel (a2)


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